# US 2022/0037564 A1 · Light emitting device and adaptive driving beam headlamp

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- Number: US 2022/0037564 A1
- Document ID: US20220037564A1
- Status: Published application
- Kind: A1
- Application number: 17/502,939
- Filed: 2021-10-15
- Published: 2022-02-03
- Earliest claimed: 2017-02-13
- Assignees: Nichia Corporation
- Applicants: Nichia Corporation
- Inventors: Toru TARUKI; Daisuke SANGA
- Web page: https://patentgrep.com/patent/US20220037564A1

## CPC

- H10H 20/8514: {characterised by their shape, e.g. plate or foil}
- H10H 20/018: {Bonding of wafers}
- H10H 20/813: having a plurality of light-emitting regions, e.g. multi-junction LEDs or light-emitting devices having photoluminescent regions within the bodies
- H10H 20/82: Roughened surfaces, e.g. at the interface between epitaxial layers
- H10H 20/83: Electrodes
- H10H 20/8312: {extending at least partially through the bodies}
- H10H 20/8512: {Wavelength conversion materials}
- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- H10H 29/142: {Two-dimensional arrangements, e.g. asymmetric LED layout}
- H10W 90/00: Package configurations
- F21S 41/153: arranged in a matrix
- F21S 41/192: {Details of lamp holders, terminals or connectors}
- F21Y 2115/10: Light-emitting diodes [LED]
- H10H 20/0361: {of wavelength conversion means}
- H10H 20/0364: {of interconnections}
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- F21S: NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21Y: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED

## Abstract

A light emitting device includes: a base; a first terminal and a second terminal located at a surface of the base; a light emitting element array chip mounted on the base, the light emitting element array chip including: a support substrate, a plurality of first wirings and a plurality of second wirings disposed on the support substrate, and a plurality of light emitting elements, each of the light emitting elements arranged on the first wiring and the second wiring and electrically connected to the first wiring and the second wiring; and a plurality of wires including a first wire connecting the first wiring to the first terminal, and a second wire connecting the second wiring to the second terminal.

## Claims

### Claim 1

A light emitting device comprising:
a base;
a first terminal and a second terminal located at a surface of the base;
a light emitting element array chip mounted on the base, the light emitting element array chip comprising:
a support substrate,
a plurality of first wirings and a plurality of second wirings disposed on the support substrate, and
a plurality of light emitting elements, each of the light emitting elements arranged on the first wiring and the second wiring and electrically connected to the first wiring and the second wiring; and
a plurality of wires including a first wire connecting the first wiring to the first terminal, and a second wire connecting the second wiring to the second terminal.

### Claim 2 (depends on 1)

The light emitting device according to claim 1, wherein, in a plan view, the light emitting element array chip is mounted on the base such that the light emitting element array chip is located between the first terminal and the second terminal.

### Claim 3 (depends on 1)

The light emitting device according to claim 1, further comprising a phosphor layer directly covering a surface of the light emitting element array chip.

### Claim 4 (depends on 3)

The light emitting device according to claim 3, wherein an average layer thickness of the phosphor layer is 50 μm or less.

### Claim 5 (depends on 3)

The light emitting device according to claim 3, wherein the phosphor layer has protrusions and recesses at the surface thereof, and wherein a thickness of the phosphor layer at a first protrusion among the protrusions is at least twice a thickness of the phosphor layer at a first recess among the recesses.

### Claim 6 (depends on 1)

The light emitting device according to claim 1, further comprising a drive circuit configured to individually drive the plurality of light emitting elements.

### Claim 7 (depends on 1)

The light emitting device according to claim 1, wherein a thickness of the semiconductor layer of the light emitting elements is in a range of 1 to 10 μm.

### Claim 8 (depends on 3)

The light emitting device according to claim 3, wherein:
the phosphor layer comprises a light transmissive resin and phosphor particles, and
a refractive index of the resin is in a range of 1.30 to 1.50.

### Claim 9 (depends on 3)

The light emitting device according to claim 3, wherein an average particle diameter of the phosphor particles contained in the phosphor layer is in a range of 1 to 30 μm.

### Claim 10 (depends on 1)

An adaptive driving beam headlamp comprising the light emitting device according to claim 1.