# US 2022/0037339 A1 · Integrated circuit including memory cell and method of designing the same

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- Number: US 2022/0037339 A1
- Document ID: US20220037339A1
- Status: Published application
- Kind: A1
- Application number: 17/371,522
- Filed: 2021-07-09
- Published: 2022-02-03
- Earliest claimed: 2020-07-31
- Assignees: Samsung Electronics Co., Ltd.
- Applicants: Samsung Electronics Co., Ltd.
- Inventors: Inhak LEE; Seunghun LEE; Sangyeop BAECK; Seunghan PARK; Hyejin LEE
- Web page: https://patentgrep.com/patent/US20220037339A1

## CPC

- H10B 10/12: {comprising a MOSFET load element}
- H10D 89/10: Integrated device layouts
- G11C 5/063: {Voltage and signal distribution in integrated semi-conductor memory access lines, e.g. word-line, bit-line, cross-over resistance, propagation delay}
- G11C 11/412: using field-effect transistors only
- G11C 11/417: for memory cells of the field-effect type
- H10D 62/121: {oriented parallel to substrates}
- B82Y 10/00: Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
- H10D 30/501: {FETs having stacked nanowire, nanosheet or nanoribbon channels}
- H10B: ELECTRONIC MEMORY DEVICES
- H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- G11C: STATIC STORES (semiconductor memory devices H10B)
- B82Y: SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES

## Abstract

An integrated circuit includes: a first wiring layer on which a first bit line pattern and a positive power supply pattern, a first power supply line landing pad, and a first word line landing pad are formed; a second wiring layer on which a first negative power supply pattern connected to the first power supply line landing pad, and a first word line pattern connected to the first word line landing pad are formed; a third wiring layer on which a second negative power supply pattern connected to the first negative power supply pattern, and a second word line landing pad connected to the first word line pattern are formed; and a fourth wiring layer on which a second word line pattern, connected to the second word line landing pad, are formed.

## Claims

### Claim 1

An integrated circuit comprising a plurality memory cells, the integrated circuit comprising:
a first wiring layer comprising:
a first bit line pattern and a positive power supply pattern extending in a first direction, the positive power supply pattern being configured to provide a positive supply voltage; and
a plurality of first power supply line landing pads configured to provide a negative supply voltage, and a plurality of first word line landing pads configured to provide a word line voltage;
a second wiring layer comprising:
a first negative power supply pattern extending in a second direction, and connecting first power supply line landing pads, which are adjacent to each other in the second direction among the plurality of first power supply line landing pads, to each other, and configured to provide the negative supply voltage; and
a plurality of first word line patterns extending in the second direction, connected to the plurality of first word line landing pads, and configured to provide the word line voltage;
a third wiring layer comprising:
a second negative power supply pattern connected to the first negative power supply pattern; and
a plurality of second word line landing pads connected to the plurality of first word line patterns; and
a fourth wiring layer comprising:
a plurality of second word line patterns extending in the second direction, connected to the plurality of second word line landing pads, and configured to provide the word line voltage.

### Claim 2 (depends on 1)

The integrated circuit of claim 1, wherein the second negative power supply pattern on the third wiring layer extends in the first direction.

### Claim 3 (depends on 1)

The integrated circuit of claim 1, wherein the second negative power supply pattern is formed in a mesh pattern on the third wiring layer.

### Claim 4 (depends on 1)

The integrated circuit of claim 1, further comprising a first via layer which comprises:
at least one first via extending in a third direction, and connecting at least one of the first power supply line landing pads, which are adjacent to each other in the second direction among the plurality of first power supply line landing pads, to the first negative power supply pattern; and
at least one second via extending in the third direction and connecting the plurality of first word line landing pads to the plurality of first word line patterns.

### Claim 5 (depends on 4)

The integrated circuit of claim 4, wherein a cross-sectional area of the first via is greater than a cross-sectional area of the second via.

### Claim 6

(canceled)

### Claim 7 (depends on 4)

The integrated circuit of claim 4, further comprising a second via layer which comprises:
at least one third via extending in the third direction, and connecting the first negative power supply pattern to the second negative power supply pattern; and
a fourth via extending in the third direction, and connecting at least one of the plurality of first word line patterns to at least one the plurality of second word line landing pads.

### Claim 8 (depends on 7)

The integrated circuit of claim 7, wherein a cross-sectional area of the third via is greater than a cross-sectional area of the fourth via.

### Claim 9 (depends on 1)

The integrated circuit of claim 1, wherein a width of a portion of at least one of the plurality of first word line patterns, the portion being adjacent to the first negative power supply pattern, is less than a width of another portion of the at least one of the plurality of first word line patterns, the other portion not being adjacent to the first negative power supply pattern.

### Claim 10 (depends on 1)

The integrated circuit of claim 1, wherein the second wiring layer further comprises a bit line landing pad formed on the second wiring layer, and connected to the first bit line pattern.

### Claim 11 (depends on 10)

The integrated circuit of claim 10, wherein the third wiring layer further comprises a second bit line pattern formed on the third wiring layer, connected to the bit line landing pad, and extending in the first direction.

### Claim 12 (depends on 1)

The integrated circuit of claim 1, wherein the plurality of second word line patterns are arranged to be adjacent to each other on the fourth wiring layer.

### Claim 13 (depends on 1)

The integrated circuit of claim 1, wherein the memory cells comprise a static random access memory (SRAM) cell in a six-transistors (6T) structure.

### Claim 14

An integrated circuit comprising a plurality memory cells, the integrated circuit comprising:
a bit line structure comprising:
a first bit line pattern formed on a first wiring layer, configured to provide a bit line voltage to the memory cells, and extending in a first direction;
a word line structure comprising:
a plurality of first word line landing pads formed on the first wiring layer, and configured to provide a word line voltage to the memory cells;
a plurality of first word line patterns formed on a second wiring layer, extending in a second direction perpendicular to the first direction, and connected to the plurality of first word line landing pads;
a plurality of second word line landing pads formed on a third wiring layer and connected to the plurality of first word line patterns; and
a plurality of second word line patterns formed on a fourth wiring layer, extending in the second direction, and connected to the plurality of second word line landing pads; and
a negative power supply line structure comprising:
a plurality of first power supply line landing pads formed on the first wiring layer, and configured to provide a negative supply voltage to the memory cells;
a first negative power supply pattern formed on the second wiring layer, extending in the second direction, and connecting first power supply line landing pads, which are adjacent to each other in the second direction among the plurality of first power supply line landing pads, to each other; and
a second negative power supply pattern formed on the third wiring layer and connected to the first negative power supply pattern.

### Claim 15 (depends on 14)

The integrated circuit of claim 14, wherein the second negative power supply pattern on the third wiring layer extends in the first direction.

### Claim 16 (depends on 14)

The integrated circuit of claim 14, the second negative power supply pattern is formed in a mesh pattern on the third wiring layer.

### Claim 17

(canceled)

### Claim 18

An integrated circuit comprising a plurality memory cells, the integrated circuit comprising:
a bit line structure and a word line structure; and
a negative power supply line structure comprising:
a plurality of first power supply line landing pads formed on a first wiring layer, and configured to provide a negative supply voltage to the memory cells;
a first negative power supply pattern formed on a second wiring layer, and connecting first power supply line landing pads, which are adjacent to each other among the plurality of first power supply line landing pads, to each other; and
a second negative power supply pattern formed on a third wiring layer and connected to the first negative power supply pattern.

### Claim 19 (depends on 18)

The integrated circuit of claim 18, wherein the word line structure comprises:
a plurality of first word line landing pads formed on a first wiring layer, and configured to provide a word line voltage to the memory cells;
a plurality of first word line patterns formed on the second wiring layer, and connected to the plurality of first word line landing pads;
a plurality of second word line landing pads formed on the third wiring layer, and connected to the plurality of first word line patterns; and
a plurality of second word line patterns formed on a fourth wiring layer, and connected to the plurality of second word line landing pads.

### Claim 20 (depends on 19)

The integrated circuit of claim 19, wherein the fourth wiring layer does not include a bit line patter, a word line pattern, a positive power supply pattern, and a negative power supply pattern.

### Claim 21 (depends on 18)

The integrated circuit of claim 18, wherein the second negative power supply pattern on the third wiring layer extends in a first direction, and
wherein the first negative power supply pattern formed on the second wiring layer extends in a second direction.

### Claim 22 (depends on 18)

The integrated circuit of claim 18, wherein the bit line structure comprises:
a first bit line pattern formed on a first wiring layer, configured to provide a bit line voltage to the memory cells, and extending in a first direction; and
a second bit line pattern formed on the third wiring layer, and connected to the bit line landing pad, and extending in the first direction.

### Claim at position 23

23-27. (canceled)