# US 2022/0037271 A1 · Electronic device package and method of manufacturing electronic device package > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2022/0037271 A1 - Document ID: US20220037271A1 - Status: Published application - Kind: A1 - Application number: 17/076,106 - Filed: 2020-10-21 - Published: 2022-02-03 - Earliest claimed: 2020-07-29 - Assignees: Samsung Electro-Mechanics Co., Ltd. - Applicants: Samsung Electro-Mechanics Co., Ltd. - Inventors: Seok Yoon HONG; Seohyun PARK; Hyukki KWON; Hansu PARK - Web page: https://patentgrep.com/patent/US20220037271A1 ## CPC - H10W 44/20: at high-frequency [HF] or radio frequency [RF] - H01Q 1/2283: {mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package} - H01Q 1/526: {Electromagnetic shields} - H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons - H10W 74/014: {using batch processing} - H10W 74/114: {by a substrate and the encapsulations} - H10W 90/00: Package configurations - H10W 44/248: {for antennas} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72) ## Abstract An electronic device package includes: a board including first surface and a second surface facing away from each other, and including a first layer adjacent to the first surface and a second layer adjacent to the second surface, wherein a step portion is formed on a side surface between the first layer and the second layer; an electronic device mounted on the first surface; an antenna layer formed in the second layer or on the second surface; a molded portion formed to cover the electronic device on the first surface; and a conductive film formed to cover a surface of the molded portion and a side surface of the first layer, and including an end portion positioned at the step portion. ## Claims ### Claim 1 An electronic device package, comprising: a board including first surface and a second surface facing away from each other, and including a first layer adjacent to the first surface and a second layer adjacent to the second surface, wherein a step portion is formed on a side surface between the first layer and the second layer; an electronic device mounted on the first surface; an antenna layer formed in the second layer; a molded portion formed to cover the electronic device on the first surface; and a conductive film formed to cover a surface of the molded portion and a side surface of the first layer, and including an end portion positioned at the step portion. ### Claim 2 (depends on 1) The electronic device package of claim 1, wherein the step portion is formed by a side surface of the second layer protruding farther than the side surface of the first layer in a direction parallel to the first surface. ### Claim 3 (depends on 2) The electronic device package of claim 2, wherein the step portion includes a curved surface connecting the side surface of the first layer to the side surface of the second layer. ### Claim 4 (depends on 1) The electronic device package of claim 1, wherein the step portion extends along a circumference on a side surface of the board on which the conductive film is formed. ### Claim 5 (depends on 1) The electronic device package of claim 1, wherein the step portion is formed on at least three side surfaces of the board disposed adjacent to each other along a circumference of the board, and on which the conductive film is formed. ### Claim 6 (depends on 1) The electronic device package of claim 1, wherein the board further includes a core insulation layer as an intermediate layer, and wherein the step portion is disposed on a side surface of the core insulation layer. ### Claim 7 (depends on 6) The electronic device package of claim 6, wherein the core insulation layer is positioned over the first layer and the second layer. ### Claim 8 (depends on 6) The electronic device package of claim 6, wherein an end portion of the conductive film is disposed on a portion of the step portion formed on the side surface of the core insulation layer. ### Claim 9 (depends on 1) The electronic device package of claim 1, wherein the conductive film is not formed on a side surface of the second layer. ### Claim 10 (depends on 1) The electronic device package of claim 1, wherein the antenna layer is disposed on the second surface. ### Claim 11 (depends on 1) The electronic device package of claim 1, wherein: the electronic device includes a first component covered by the molded portion and a second component disposed outside the molded portion; a conductive shielding wall is disposed between the first component and the second component; the conductive film is formed on a portion of the surface of the molded portion covering the first component; and the shielding wall forms a boundary of the conductive film. ### Claim 12 A method of manufacturing an electronic device package, comprising: preparing a strip board including a first surface and a second surface facing away from each other, wherein the strip board includes a first layer adjacent to the first surface and a second layer adjacent to the second surface, and wherein an antenna layer is formed on or in the second layer; forming a plurality of package units by mounting an electronic device on the first surface of the strip board and forming a molded portion covering the electronic device; forming a first cutting groove having a first width by partially sawing the strip board through the first layer for each package unit among the plurality of package units; forming a second cutting groove having a second width narrower than the first width by partially sawing the strip board through the second layer for each package unit; separating the strip board into a board for each package unit to form a step portion on a side surface between the first layer and the second layer; and forming a conductive film on the board for each package unit such that the conductive film extends from the molded portion to the step portion on the side surface between the first layer and the second layer. ### Claim 13 (depends on 12) The method of claim 12, wherein the forming of the conductive film comprises: forming the conductive film to cover a surface of the molded portion and a side surface of the board for each package unit; and removing a portion of the conductive film formed below the step portion on a side surface of the second layer of the board for each package unit. ### Claim 14 (depends on 12) The method of claim 12, wherein the forming of the conductive film comprises: interposing a masking block between adjacent package units among the plurality of package units to expose a side surface of the first layer of the board for each package unit and to cover a side surface of the second layer of the board for each package unit; and forming the conductive film to cover a surface of the molded portion and the side surface of the first layer of the board for each package unit. ### Claim 15 An electronic device package, comprising: a board comprising a first layer and a second layer disposed below the first layer; an electronic device mounted on an upper surface of the first layer; an antenna layer formed in or on the second layer; a molded portion formed to cover the electronic device on the upper surface of the first layer; and a conductive film formed to cover a surface of the molded portion and a side surface of the first layer, wherein the side surface of the second layer extends farther than a corresponding side surface of the first layer, in a direction parallel to the upper surface of the first layer, and wherein the conductive film is not disposed on the corresponding side surface of the second layer. ### Claim 16 (depends on 15) The electronic device package of claim 15, wherein an end portion of the conductive film is disposed on a step portion connecting the side surface of the first layer to the corresponding side surface of the second layer. ### Claim 17 (depends on 16) The electronic device of claim 16, wherein the step portion has a curved surface. ### Claim 18 (depends on 15) The electronic device of claim 15, wherein the board further comprises a core insulation layer disposed between the first layer and the second layer, and forming a step portion connecting the side surface of the first layer to the corresponding side surface of the second layer. ### Claim 19 (depends on 18) The electronic device of claim 18, wherein the conductive film is disposed on the step portion.