# US 2022/0037076 A1 · High current, low equivalent series resistance printed circuit board coil for power transfer application

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- Number: US 2022/0037076 A1
- Document ID: US20220037076A1
- Status: Published application
- Kind: A1
- Application number: 17/403,662
- Filed: 2021-08-16
- Published: 2022-02-03
- Earliest claimed: 2012-02-20
- Assignees: Futurewei Technologies, Inc.
- Applicants: Futurewei Technologies, Inc.
- Inventors: Jorge ZABACO
- Web page: https://patentgrep.com/patent/US20220037076A1

## CPC

- H01F 27/2804: {Printed windings}
- H01F 17/0013: {with stacked layers}
- H01F 38/14: Inductive couplings
- H01F 41/041: {Printed circuit coils (apparatus or processes for manufacturing printed circuits in general H05K3/00)}
- H02J 50/12: of the resonant type
- H04B 5/79: for data transfer in combination with power transfer
- H01F 27/2809: {on stacked layers}
- H01F 2017/002: {Details of via holes for interconnecting the layers}
- Y10T 29/4902: Electromagnet, transformer or inductor
- H01F: MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H02J: ELECTRIC POWER NETWORKS; CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H04B: TRANSMISSION
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

An apparatus for a multilayer printed circuit board (PCB) coil, comprising: a first coil layer of a PCB; a plurality of vias coupled to and distributed to cover substantially the surface of the first coil layer within the PCB; and a second coil layer of the PCB and coupled to the vias to cover substantially the surface of the second coil layer, wherein the vias are positioned between the first coil layer and the second coil layer and enable substantially high current and low equivalent series resistance (ESR) for the multilayer PCB coil.

## Claims

### Claim 1

A smartphone, comprising:
a housing; and
a wireless charging coil, the coil including a layered structure of electric conductors on a printed circuit board (PCB), wherein the layered structure comprises:
a first layer including a first electrically conductive trace comprising a first turn and a second turn adjacent to the first turn;
a second layer including a second electrically conductive trace comprising a third turn and a fourth turn adjacent to the third turn; and
a plurality of vias coupling the first layer and the second layer, wherein the plurality of the vias include a first via, a second via and a third via distributed along a length of the first turn, each of the first via, the second via and the third via electrically connecting the first turn and the third turn, wherein the plurality of the vias further include a fourth via, a fifth via, and a sixth via distributed along a length of the second turn, each of the fourth via, fifth via, and sixth via electrically connecting the second turn and the fourth turn, wherein the first via, the second via , the third via, the fourth via, the fifth via, and the sixth via are distributed separately in locations other than locations of taps of the first and second trace.

### Claim 2 (depends on 1)

The smartphone of claim 1, wherein the second via is neighboring to both the first via and third via, wherein the fifth via is neighboring to both the fourth via and the sixth via, wherein the first via, the second via, and the third via are on a curved section of the coil.

### Claim 3 (depends on 2)

The smartphone of claim 2, wherein the first layer includes a fifth turn adjacent to the second turn and the second layer includes a sixth turn adjacent to the fourth turn, wherein the plurality of vias include a seventh via, an eighth via and a nine via distributed along a length of the fifth turn, each of the seventh via, an eighth via and a nine via electrically connecting the fifth turn and the sixth turn, wherein the seventh via, the eighty via and the ninth via are on the curved section of the coil, wherein first via, the fourth via and the seventh via are on a first straight line, the second via, the fifth via and the eighth via are on a second straight line, and the third via, the sixth via and the ninth via are on a third straight line.

### Claim 4 (depends on 3)

The smartphone of claim 3, wherein the smartphone is thinner than 1 cm.

### Claim 5 (depends on 4)

The smartphone of claim 4, wherein the plurality of vias include at least one via having a size different from a size of the first via.

### Claim 6 (depends on 5)

The smartphone of claim 5, wherein the smartphone has a touch screen, a speaker and a camera.

### Claim 7 (depends on 1)

The smartphone of claim 1, wherein the smartphone is thinner than 1 cm.

### Claim 8 (depends on 1)

The smartphone of claim 1, wherein the smartphone has a touch screen, a speaker and a camera.

### Claim 9 (depends on 1)

The smartphone of claim 1, wherein the plurality of vias include at least one via having a size different from a size of the first via.