# US 2022/0035246 A1 · Method for producing plated formed product

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 2022/0035246 A1
- Document ID: US20220035246A1
- Status: Published application
- Kind: A1
- Application number: 17/298,769
- Filed: 2019-12-06
- Published: 2022-02-03
- Earliest claimed: 2018-12-12
- Assignees: Jsr Corporation
- Applicants: Jsr Corporation
- Inventors: Naoki NISHIGUCHI; Tomoyuki MATSUMOTO; Akira ISHII; Ayako ENDO
- Web page: https://patentgrep.com/patent/US20220035246A1

## CPC

- G03F 7/039: Macromolecular compounds which are photodegradable, e.g. positive electron resists (G03F7/075 takes precedence; macromolecular quinonediazides G03F7/023)
- C25D 5/02: Electroplating of selected surface areas
- C25D 5/022: {using masking means}
- C25D 5/34: Pretreatment of metallic surfaces to be electroplated
- C25D 7/00: Electroplating characterised by the article coated
- C25D 7/123: {Semiconductors first coated with a seed layer or a conductive layer}
- G03F 7/0392: {the macromolecular compound being present in a chemically amplified positive photoresist composition}
- G03F 7/0397: {the macromolecular compound having an alicyclic moiety in a side chain}
- G03F 7/085: Photosensitive compositions characterised by adhesion-promoting non-macromolecular additives (G03F7/075 takes precedence)
- G03F 7/40: Treatment after imagewise removal, e.g. baking
- H05K 3/18: using precipitation techniques to apply the conductive material
- H10P 14/47: Electrolytic deposition, i.e. electroplating; Electroless plating
- H10P 70/20: {Cleaning during device manufacture}
- H10P 70/27: {during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers}
- H10P 76/2041: {Photolithographic processes}
- H10P 95/08: {Planarisation of organic insulating materials}
- C25D 3/38: of copper
- G03F 7/027: Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds (G03F7/075 takes precedence)
- G03F 7/0275: {with dithiol or polysulfide compounds}
- G03F 7/038: Macromolecular compounds which are rendered insoluble or differentially wettable (G03F7/075 takes precedence; macromolecular azides G03F7/012; macromolecular diazonium compounds G03F7/021)
- H10W 20/063: {by forming conductive members before forming protective insulating material}
- G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G)
- C25D: PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A method for producing a plated formed product includes: a step (1) of forming on a substrate of the substrate having a metal film a resin film of a photosensitive resin composition containing a sulfur-containing compound having at least one selected from a mercapto group, a sulfide bond, and a polysulfide bond; a step (2) of exposing the resin film; a step (3) of developing the exposed resin film to form a resist pattern film; a step (4) of performing plasma treatment of a substrate having the resist pattern film on the metal film with oxygen-containing gas; and a step (5) of performing, after the plasma treatment, plating treatment with the resist pattern film as a mold.

## Claims

### Claim at position 1

1: A method for producing a plated formed product, the method comprising:
a step (1) of forming on a substrate of the substrate having a metal film a resin film of a photosensitive resin composition containing a sulfur-containing compound having at least one selected from a mercapto group, a sulfide bond, and a polysulfide bond;
a step (2) of exposing the resin film;
a step (3) of developing the exposed resin film to form a resist pattern film;
a step (4) of performing plasma treatment of a substrate having the resist pattern film on the metal film with oxygen-containing gas; and
a step (5) of performing, after the plasma treatment, plating treatment with the resist pattern film as a mold.

### Claim at position 2 (depends on 1)

2: The method for producing a plated formed product according to claim 1, wherein the photosensitive resin composition further contains polymer (A) having an acid dissociative group and photoacid generator (B).

### Claim at position 3 (depends on 2)

3: The method for producing a plated formed product according to claim 2, wherein a content of the sulfur-containing compound is 0.2 to 2.0 parts by mass, with respect to 100 parts by mass of a polymer component including polymer (A) having an acid dissociative group included in the photosensitive resin composition.

### Claim at position 4 (depends on 1)

4: The method for producing a plated formed product according to claim 1, wherein the resist pattern film has a thickness of 1 to 100 μm.

### Claim at position 5 (depends on 1)

5: The method for producing a plated formed product according to claim 1, wherein the metal film is a copper film.

### Claim at position 6 (depends on 1)

6: The method for producing a plated formed product according to claim 1, wherein the plating treatment is a copper plating treatment.

### Claim at position 7 (depends on 1)

7: The method for producing a plated formed product according to claim 1, comprising a step of washing a substrate having a plasma-treated resist pattern film on a metal film with an acid before the step (5).

### Claim at position 8 (depends on 1)

8: The method for producing a plated formed product according to claim 1, comprising a step of washing a substrate having a plasma-treated resist pattern film on a metal film with an aqueous solution of potassium permanganate or an aqueous solution of sulfuric acid before the step (5).