# US 2022/0034838 A1 · Flip Chip Thin Film Hybrid Screen Printed Electrode Test Strip

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- Number: US 2022/0034838 A1
- Document ID: US20220034838A1
- Status: Published application
- Kind: A1
- Application number: 16/943,914
- Filed: 2020-07-30
- Published: 2022-02-03
- Earliest claimed: 2020-07-30
- Inventors: Wei Zheng; Xin Zhao
- Web page: https://patentgrep.com/patent/US20220034838A1

## CPC

- G01N 27/308: {at least partially made of carbon}
- G01N 27/4148: {Integrated circuits therefor, e.g. fabricated by CMOS processing}
- G01N 27/307: {Disposable laminated or multilayered electrodes (G01N27/3272 takes precedence)}
- G01N 27/4145: {specially adapted for biomolecules, e.g. gate electrode with immobilised receptors}
- G01N 27/4146: {involving nanosized elements, e.g. nanotubes, nanowires}
- G01N: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES (measuring or testing apparatus or processes other than immunoassay, involving enzymes or microorganisms C12M, C12Q)

## Abstract

This invention is about a product of a flip chip thin film hybrid screen printed electrode. It combines a primary screen printed electrode (SPE) device and a thin film material coated chip, in order to make a hybridized product. The product is used as a test strip for electrochemical analysis, such as environmental, bio-electrochemical and biomedical sensors. The hybridized electrodes design takes the benefits of low cost of screen printing technology, and high sensitivity of thin film coating nanotechnology. This invention is also about applying a flip chip method to manufacture the hybrid electrode. A chip of thin film material coated solid state substrate is surface mounted to a preliminary perforated SPE by a flip chip method/process. This method/process is fast, easy, cheap, uniform, and suitable for large scale manufacturing.

## Claims

### Claim 1

A test strip for electrochemical stripping analysis, comprising:
a main body made of a insulative sheet material in a strip format, having a perforated hole, having a upside surface and down side surface;
a set of counter electrode, on the up side surface of the main body , in the proximity of the hole;
a set of reference electrode, on the up side surface of the main body, in the proximity of the hole;
a set of work electrode, made of a chip, mounted to the down side surface of the main body;

### Claim 2 (depends on 1)

For the test strip product of the claim 1,
the work electrode chip is made of a solid state substrate, such as a piece of graphite paper, carbon paper, ceramics, mica, glass, polymer plastics, silicon wafer, and a thin film material is deposited on the chip surface;

### Claim 3 (depends on 1)

For the test strip product of the claim 1,
the chip is coated by a thin film technology via a physical vapor deposition (PVD), a chemical vapor deposition (CVD), or a plasma enhanced chemical vapor deposition (CVD) method;

### Claim 4 (depends on 1)

For the test strip product in the claim 1,
the thin film material is made of the vertically free standing graphene containing carbon nanosheets material (Vertical Graphene).

### Claim 5 (depends on 1)

For the test strip product of the claim 1,
the sheet thickness of the test strip main body is in the range of 100 micrometers to 3 millimeters.

### Claim 6 (depends on 1)

For the test strip product of the claim 1,
the perforated hole is in circular shape.

### Claim 7 (depends on 1)

For the test strip product of the claim 1, wherein:
between the surface mounted chip and the test strip's down side surface, there is a layer of conductive or non-conductive glue material, in order to bonding the chip and down side surface.

### Claim 8 (depends on 1)

For the test strip product of the claim 1, wherein:
the main body has a multiplicity of holes and comprise a multiplicity of reference electrodes and counter electrodes, and a multiplicity of work electrode chips mounted to each perforated holes respectively.

### Claim 9 (depends on 1)

A method of making the test strip product in claim 1, includes but not limited to the processes of:
Step 1. To make a preliminary test strip main body, whose up and down side surface are both screen printed with traces of electrodes;
Step 2. To perforate the main body with a through hole;
Step 3. To apply a thin layer of a glue material on the down side surface.
Step 4. To surface mounting a chip to the down side surface before the glue drying or curing. The chip was preliminary deposited by a thin film material. The chip completely covers up and seals the perforated hole from the down side.
Step 5. To drying or curing the glue material till solidification in order to seal the perforated hole from the down side.
Step 6. To attach a protection backplate on the chip mounted down side.