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US 2022/0033960 A1Published application
Sputtering Target and Method for Producing Same
AssigneeJX Nippon Mining & Metals Corporation
InventorsDaiki Shono, Shuhei Murata, Takeo Okabe
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Abstract
Provided is a cylindrical sputtering target made of a metal material, which has reduced particles. The sputtering target includes at least a target material, wherein the target material comprises one or more metal elements, the target material has a crystal grain size of 50 μm or less, and the target material has an oxygen concentration of 1000 ppm by mass or less.
Claims7
A cylindrical sputtering target, wherein:
- the sputtering target comprises at least a target material;
- the target material comprises one or more metal elements;
- the target material has a crystal grain size of 50 μm or less;
- and
- the target material has an oxygen concentration of 1000 ppm by mass or less.
2 more elements
Dependencies are inferred from the claim text.