# US 2022/0033685 A1 · Process for hot application of a silylated adhesive composition

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- Number: US 2022/0033685 A1
- Document ID: US20220033685A1
- Status: Published application
- Kind: A1
- Application number: 17/500,484
- Filed: 2021-10-13
- Published: 2022-02-03
- Earliest claimed: 2013-12-19
- Assignees: Bostik SA
- Applicants: Bostik SA
- Inventors: Jean Francois CHARTREL; Olivier LAFERTE; Lahoussaine LALOUCH
- Web page: https://patentgrep.com/patent/US20220033685A1

## CPC

- C09J 5/06: involving heating of the applied adhesive
- B01F 25/3131: {with additional mixing means other than injector mixers, e.g. screens, baffles or rotating elements}
- B01F 25/43161: {composed of consecutive sections of flat pieces of material}
- B01F 35/95: using heated or cooled stirrers
- B05D 5/10: to obtain an adhesive surface
- C08G 18/837: {by silicon containing compounds}
- C08G 65/336: containing silicon
- C09J 175/04: Polyurethanes
- B01F 25/431972: {Mounted on an axial support member, e.g. a rod or bar}
- B01F 2035/99: {Heating}
- B01F 2101/36: Mixing of ingredients for adhesives or glues; Mixing adhesives and gas
- B05C 5/0254: {Coating heads with slot-shaped outlet (B05C5/0283 takes precedence)}
- B05C 11/1042: {provided with means for heating or cooling the liquid or other fluent material in the supplying means upstream of the applying apparatus}
- B05D 1/26: performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
- B05D 1/34: Applying different liquids or other fluent materials simultaneously
- B05D 2252/02: of indefinite length
- C09J 2475/00: Presence of polyurethane
- C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H)
- B01F: MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING (mixing paints B44D3/06)
- B05D: PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL (conveying articles or workpieces through baths of liquid B65G, e.g. B65G49/02)
- C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- B05C: APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL (spraying apparatus, atomising apparatus, nozzles B05B; plant for applying liquids or other fluent materials to objects by electrostatic spraying B05B5/08)

## Abstract

The invention relates to a process for hot application of an adhesive composition (80) on a support (96), by means of a system comprising: a nozzle (50) for applying the adhesive composition (80), a line (88) for supplying the nozzle (50) with the adhesive composition (80) to be applied in fluid form, a mixer (30) positioned in the line (88) for the homogeneous mixture of the main components of the adhesive composition before its application; the applied adhesive composition (80) including as main components: a silylated prepolymer, a compatible tackifying resin; the adhesive composition comprising a cross-linking catalyst; the process comprising: supplying the line (88) with the silylated prepolymer separated from the cross-linking catalyst, the mixing of the cross-linking catalyst with the main components by means of the mixer (30), the hot application of the mixed adhesive composition (80) onto a support (96).

## Claims

### Claim 1

A process for hot application of an adhesive composition on a support comprising employing a hot application system comprising:
an application nozzle applying the adhesive composition,
a supply line supplying the application nozzle with the adhesive composition to be applied in fluid form,
a dynamic mixer positioned in the supply line homogeneously mixing main components of the adhesive composition before its application;
the applied adhesive composition including as main components:
from 20% to 85% by weight of silylated pre-polymer,
from 15 to 80% by weight of compatible tackifying resin;
the adhesive composition further comprising from 0.01 to 3% by weight of cross-linking catalyst;
the process comprising:
supplying the supply line with said at least silylated prepolymer, separate from the cross-linking catalyst,
mixing the cross-linking catalyst with the main components in the mixer,
hot application of the mixed adhesive composition on a support by the application nozzle,
wherein the conversion rate of the cross-linking reaction for the adhesive composition in the hot application system is less than or equal to 30%.

### Claim 2 (depends on 1)

The hot application process according to claim 1, wherein, upon supplying the supply line, the cross-linking catalyst is separated from the whole of the main components of the adhesive composition.

### Claim 3

(canceled)

### Claim 4 (depends on 1)

The hot application process according to claim 1, wherein the mixer includes an electrically conducting material, the hot application system comprising an in-line heating device, upstream from the mixing point of the cross-linking catalyst with the main components and including the mixer and an inductive cable surrounding the mixer, the process comprising, prior to the hot application, heating of the adhesive composition up to the application temperature, by electrically powering the inductive cable of the in-line heating device.

### Claim 5

(canceled)

### Claim 6 (depends on 1)

The hot application process according to claim 1, wherein the adhesive composition to be applied comprises a reactive prepolymer which cross-links in a temperature range, the adhesive composition to be applied having an application temperature range included in the cross-linking temperature range.

### Claim 7 (depends on 1)

The hot application process according to claim 1, wherein the adhesive composition to be applied cross-links with humidity.

### Claim 8 (depends on 1)

The hot application process according to claim 1, wherein the system comprises a heater able to be positioned at a storage reservoir comprising at least one of the separate main components for raising said at least one main component to a pumping temperature.

### Claim 9 (depends on 8)

The hot application process according to claim 8, wherein said at least one separate main component is raised to a pumping temperature comprised between 50° C. and 140° C.

### Claim 10 (depends on 1)

The hot application process according to claim 1, wherein the adhesive composition is applied at a temperature comprised between 50° C. and 140° C.

### Claim 11

(canceled)

### Claim 12

(canceled)

### Claim 13

(canceled)

### Claim 14

(canceled)

### Claim 15 (depends on 1)

The hot application process according to claim 1 wherein the adhesive composition is applied at a temperature comprised between 80° C. and 120° C.

### Claim 16 (depends on 1)

The hot application process according to claim 1 wherein the adhesive composition is applied at a temperature comprised between 100° C. and 110° C.

### Claim 17

(canceled)

### Claim 18

(canceled)

### Claim 19

(canceled)

### Claim 20 (depends on 6)

The hot application process according to claim 6, wherein the adhesive composition is applied at a temperature comprised between 50° C. and 140° C.

### Claim 21 (depends on 1)

The hot application process according to claim 1, wherein the hot application system comprises an in-line heating device.

### Claim 22 (depends on 8)

The hot application process according to claim 8, wherein said at least one separate main component is raised to a pumping temperature comprised between 80° C. and 120° C.

### Claim 23 (depends on 8)

The hot application process according to claim 8, wherein said at least one separate main component is raised to a pumping temperature comprised between 100° C. and 110° C.

### Claim 24 (depends on 1)

The hot application process according to claim 1, wherein the conversion rate of the cross-linking reaction for the adhesive composition in the hot application system is less than or equal to 10%.

### Claim 25 (depends on 21)

The hot application process according to claim 21, wherein the flow rate of the adhesive composition in the in-line heating device is between 80 g·s−1 and 170 g·s−1.
