# US 2022/0033684 A1 · Polishing liquid

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- Number: US 2022/0033684 A1
- Document ID: US20220033684A1
- Status: Published application
- Kind: A1
- Application number: 17/381,804
- Filed: 2021-07-21
- Published: 2022-02-03
- Earliest claimed: 2020-07-30
- Assignees: Disco Corporation
- Applicants: Disco Corporation
- Inventors: Ayumu SAKAI; Norihisa ARIFUKU; Takeshi SATO
- Web page: https://patentgrep.com/patent/US20220033684A1

## CPC

- C09G 1/04: Aqueous dispersions (C09G1/02 takes precedence)
- B24B 37/044: {characterised by the composition of the lapping agent}
- H10P 90/129: {by polishing}
- B24B 37/245: {Pads with fixed abrasives}
- H10P 52/402: {of semiconductor materials}
- C09G: POLISHING COMPOSITIONS (French polish C09F11/00); SKI WAXES
- B24B: MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING (grinding of gear teeth B23F, of screw-threads B23G1/36; by electro-erosion B23H; abrasive or related blasting B24C; tools for grinding, buffing or sharpening B24D; polishing compositions C09G1/00; abrasives C09K3/14; electrolytic etching or polishing C25F3/00; grinding arrangements for use on assembled railway tracks E01B31/17); DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

Provided is a polishing liquid that is used when one surface of a wafer is polished by use of a fixed abrasive grain polishing pad with abrasive grains fixed in the pad, in which an organic salt that exhibits a basic property by hydrolysis and contains no metal and an organic base that contains no metal are dissolved, and no abrasive grains are contained. Preferably, the organic salt includes a strong basic cation and a weak acidic anion, and the organic base contains at least one of ammonia, an amine, and a basic amino acid.

## Claims

### Claim 1

A polishing liquid that is used when one surface of a wafer is polished by use of a fixed abrasive grain polishing pad with abrasive grains fixed in the pad,
wherein an organic salt that exhibits a basic property by hydrolysis and contains no metal and an organic base that contains no metal are dissolved, and no abrasive grains are contained.

### Claim 2 (depends on 1)

The polishing liquid according to claim 1,
wherein the organic salt includes a strong basic cation and a weak acidic anion, and
the organic base contains at least one of ammonia, an amine, and a basic amino acid.

### Claim 3 (depends on 1)

The polishing liquid according to claim 1,
wherein a concentration of the organic salt is equal to or more than 0.50 wt %, and
a concentration of the organic base is equal to or more than 0.025 wt %.