# US 2022/0033683 A1 · Titanium dioxide containing ruthenium chemical mechanical polishing slurry

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- Number: US 2022/0033683 A1
- Document ID: US20220033683A1
- Status: Published application
- Kind: A1
- Application number: 17/391,674
- Filed: 2021-08-02
- Published: 2022-02-03
- Earliest claimed: 2020-08-03
- Assignees: CMC Materials, Inc.
- Applicants: CMC Materials, Inc.
- Inventors: Jin-Hao Jhang; Cheng-Yuan Ko
- Web page: https://patentgrep.com/patent/US20220033683A1

## CPC

- C09G 1/02: containing abrasives or grinding agents {(abrasives as such C09K3/14; polishing of semi-conductors H10P52/40)}
- C09K 3/1409: {Abrasive particles per se (preparation of diamond C01B32/25)}
- C09K 3/1463: {Aqueous liquid suspensions}
- C09K 13/00: Etching, surface-brightening or pickling compositions (for glass C03C15/00, {C03C25/66; for mortars, concrete, artificial or natural stone or ceramics C04B41/5338}; for metallic material C23F, C23G1/00, C25F1/00; {for semi-conductors H10P52/40})
- H10P 52/403: {of conductive or resistive materials}
- C09G: POLISHING COMPOSITIONS (French polish C09F11/00); SKI WAXES
- C09K: MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

A chemical mechanical polishing composition for polishing a ruthenium containing substrate comprises, consists of, or consists essentially of a water based liquid carrier; titanium oxide particles dispersed in the liquid carrier, the titanium oxide particles including rutile and anatase such that an x-ray diffraction pattern of the titanium oxide particles has a ratio X:Y greater than about 0.05, wherein X represents an intensity of a peak in the x-ray diffraction pattern having a d-spacing of about 3.24 Å and Y represents an intensity of a peak in the x-ray diffraction pattern having a d-spacing of about 3.51 Å; and a pH in a range from about 7 to about 10. Optional embodiments further include a pH buffer having a pKa in a range from about 6 to about 9.

## Claims

### Claim 1

A chemical mechanical polishing composition comprising:
a water based liquid carrier;
titanium oxide particles dispersed in the liquid carrier, the titanium oxide particles including rutile and anatase such that an x-ray diffraction pattern of the titanium oxide particles has a ratio X:Y of about 0.05 to about 0.5, wherein X represents an intensity of a peak in the x-ray diffraction pattern having a d-spacing of about 3.24 Å and Y represents an intensity of a peak in the x-ray diffraction pattern having a d-spacing of about 3.51 Å; and
a pH in a range from about 7 to about 10.

### Claim 2 (depends on 1)

The composition of claim 1, wherein the pH is in a range from about 7.5 to about 9.5.

### Claim 3 (depends on 1)

The composition of claim 1, further comprising a pH buffer having a pKa in a range from about 6 to about 9.

### Claim 4 (depends on 1)

The composition of claim 1, comprising from about 0.05 wt. % to about 1 wt. % of the titanium oxide particles.

### Claim 5 (depends on 1)

The composition of claim 1, further comprising a peroxide compound.

### Claim 6 (depends on 1)

A method for polishing a ruthenium containing substrate, the method comprising:
(a) contacting the substrate with the polishing composition of claim 1;
(b) moving the polishing composition relative to the substrate; and
(c) abrading the substrate to remove a portion of the ruthenium layer from the substrate and thereby polish the substrate.

### Claim 7

A chemical mechanical polishing composition comprising:
a water based liquid carrier;
titanium oxide particles dispersed in the liquid carrier, the titanium oxide particles including rutile and anatase such that an x-ray diffraction pattern of the titanium oxide particles has a ratio X:Y of greater than about 0.05, wherein X represents an intensity of a peak in the x-ray diffraction pattern having a d-spacing of about 3.24 Å and Y represents an intensity of a peak in the x-ray diffraction pattern having a d-spacing of about 3.51 Å;
a pH in a range from about 7 to about 10; and
a pH buffer having a pKa in a range from about 6 to about 9.

### Claim 8 (depends on 7)

The composition of claim 7, wherein the pH buffer is selected from the group consisting of citric acid, bis tris methane, tris(hydroxymethyl)aminomethane, tricine (tris glycine), diglycine, dipotassium hydrogen phosphate, triethanolamine, (4-(2-hydroxyethyl)-1-piperazineethanesulfonic acid) (HEPES), N-(2-Hydroxyethyl)piperazine-N′-(3-propanesulfonic acid) (HEPPS), diethanolamine, bicine, N-Tris(hydroxymethyl)methyl-3-aminopropanesulfonic acid (TAPS), N-Methyldiethanolamine, 2-amino-2-methyl-1,3-propanediol (AMPD), and mixtures thereof.

### Claim 9 (depends on 7)

The composition of claim 7, wherein the pH buffer has a pKa in a range from about 7.5 to about 9.

### Claim 10 (depends on 9)

The composition of claim 9, wherein the pH buffer is selected from the group consisting of tris(hydroxymethyl)aminomethane, tricine (tris glycine), diglycine, triethanolamine, (4-(2-hydroxyethyl)-1-piperazineethanesulfonic acid) (HEPES), N-(2-Hydroxyethyl)piperazine-N′-(3-propanesulfonic acid) (HEPPS), diethanolamine, bicine, N-Tris(hydroxymethyOmethyl-3-aminopropanesulfonic acid (TAPS), N-Methyldiethanolamine, 2-amino-2-methyl-1,3-propanediol (AMPD), and mixtures thereof.

### Claim 11 (depends on 7)

The composition of claim 7, wherein the pH buffer has a pKa in a range from about 8.0 to about 8.5.

### Claim 12 (depends on 7)

The composition of claim 7 wherein the pH buffer is tris(hydroxymethyl)aminomethane.

### Claim 13 (depends on 7)

The composition of claim 7, wherein the pH is in a range from about 7.5 to about 9.5.

### Claim 14 (depends on 7)

The composition of claim 7, comprising from about 0.05 wt. % to about 1 wt. % of the titanium oxide particles.

### Claim 15 (depends on 7)

The composition of claim 7, wherein a concentration of the pH buffer is in a range from about 0.3 mM to about 30 mM.

### Claim 16 (depends on 7)

The composition of claim 7, wherein the pH is in a range from about 7.5 to about 9.5 and the pH buffer has a pKa in a range from about 7.5 to about 9.

### Claim 17 (depends on 7)

The composition of claim 7, wherein the titanium oxide particles have a ratio X:Y of greater than about 1.

### Claim 18 (depends on 7)

The composition of claim 7, wherein the titanium oxide particles have a ratio X:Y of greater than about 10.

### Claim 19 (depends on 7)

The composition of claim 7, wherein the titanium oxide is substantially pure rutile.

### Claim 20 (depends on 7)

A method for polishing a ruthenium containing substrate, the method comprising:
(a) contacting the substrate with the polishing composition of claim 7;
(b) moving the polishing composition relative to the substrate; and
(c) abrading the substrate to remove a portion of the ruthenium layer from the substrate and thereby polish the substrate.

### Claim 21 (depends on 20)

The method of claim 20, wherein:
said moving in (b) comprises moving the polishing composition relative to the substrate and a polishing pad; and
said abrading in (c) does not stain the polishing pad.