# US 2022/0032292 A1 · Biochip structure and method for making same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2022/0032292 A1 - Document ID: US20220032292A1 - Status: Published application - Kind: A1 - Application number: 17/097,253 - Filed: 2020-11-13 - Published: 2022-02-03 - Earliest claimed: 2020-07-31 - Assignees: Socle Technology Corp. - Applicants: Socle Technology Corp. - Inventors: HSIANG-HUA LU; CHING-YU NI; YING-CHIEH PAN - Web page: https://patentgrep.com/patent/US20220032292A1 ## CPC - B01J 19/0046: {Sequential or parallel reactions, e.g. for the synthesis of polypeptides or polynucleotides; Apparatus and devices for combinatorial chemistry or for making molecular arrays (synthesis methods per se C40B50/00)} - B01L 3/502715: {characterised by interfacing components, e.g. fluidic, electrical, optical or mechanical interfaces} - B01L 3/502707: {characterised by the manufacture of the container or its components} - B01J 2219/00608: DNA chips - B01J 2219/00612: the surface being inorganic - B01J 2219/00621: by physical means, e.g. trenches, raised areas - B01L 2300/0819: Microarrays; Biochips - B01J: CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS - B01L: CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE ## Abstract A method for making a biochip structure, includes: providing a substrate and forming a plurality of biochips on a surface of the substrate; forming a carrier on a side of the substrate having the biochips, defining a plurality of through holes in the substrate from a side of the substrate away from the carrier; and filling conductive material in each of the through holes to connect one of the biochips. The carrier defines a plurality of openings. Each opening cooperates with substrate to form a micro-channel, and one of the biochips is exposed in the micro-channel. ## Claims ### Claim 1 A method for making a biochip structure, comprising: providing a substrate having a plurality of biochips on a surface of the substrate; forming a carrier on a side of the substrate having the plurality of biochips, the carrier defining a plurality of openings, each of the plurality of openings cooperating with substrate to form a micro-channel, one of the plurality of biochips being exposed from the micro-channel; defining a plurality of through holes in the substrate from a side of the substrate away from the carrier; and filling conductive material in each of the plurality of through holes to connect one of the plurality of biochips. ### Claim 2 (depends on 1) The method of claim 1, further comprising forming a plurality of connection pads on the substrate, wherein each of the plurality of connection pads is electrically coupled to the conductive material in one of the plurality of through holes. ### Claim 3 (depends on 1) The method of claim 1, further comprising reducing a thickness of the substrate from a side of the substrate away from the carrier before defining the plurality of through holes in the substrate. ### Claim 4 (depends on 3) The method of claim 3, wherein the thickness of the substrate is reduced to be less than 100 micrometers. ### Claim 5 (depends on 1) The method of claim 1, further comprising cutting the substrate to form a plurality of biochip structures, wherein each of the plurality of biochip structures comprises one of the plurality of biochip, one of the plurality of micro-channels, and one of the plurality of through holes. ### Claim 6 (depends on 1) The method of claim 1, wherein forming the carrier on the substrate comprises: providing a flat carrier; defining a plurality of openings in the carrier, each of the plurality of openings extending through the carrier; coating an adhesive on a surface of the carrier with the plurality of openings; adhering the carrier to the side of the substrate having the plurality of biochips by the adhesive, and each of the plurality of openings being at least partially aligned with one of the plurality of biochips; and curing the adhesive. ### Claim 7 (depends on 1) The method of claim 1, wherein forming the plurality of biochips on a surface of the substrate comprises defining a plurality of grooves in the surface of the substrate and each of the plurality of grooves accommodating one of the plurality of biochips. ### Claim 8 (depends on 1) The method of claim 1, wherein a contact pad is between each of the plurality of biochips and the substrate. ### Claim 9 A biochip structure, comprising: a substrate having a biochip, the substrate defining a through hole, the through hole being filled in with conductive material to connect the biochip; and a carrier on a side of the substrate having the biochip, the carrier defining an opening extending through the carrier, the opening cooperating with the substrate to form a micro-channel, the biochip being exposed from the micro-channel. ### Claim 10 (depends on 9) The biochip structure of claim 9, wherein the biochip exposed from the substrate forms a sensing area; the sensing area is exposed in the micro-channel. ### Claim 11 (depends on 9) The biochip structure of claim 9, further comprising a contact pad on a side of the biochip, the contact pad being aligned with the through hole and electrically coupled to the conductive material in the through hole. ### Claim 12 (depends on 9) The biochip structure of claim 9, further comprising a connection pad is on a side of the substrate away from the carrier, the connection pad being electrically coupled to the conductive material in the through hole. ### Claim 13 (depends on 9) The biochip structure of claim 9, wherein the substate is a silicon substrate having the biochip. ### Claim 14 (depends on 9) The biochip structure of claim 9, wherein the carrier is made of silicon or glass.