Shield Package
AssigneeTatsuta Electric Wire & Cable Co., Ltd.
InventorsHiroaki UMEDA, Hidetoshi NOGUCHI, Hajime NAKAZONO, Sougo ISHIOKA
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Abstract
The present invention aims to provide a shield package having a highly distinctive patterned portion formed on a surface of a shield layer. The shield package of the present invention includes a package in which an electronic component is sealed with a sealing material, and a shield layer covering the package, wherein a surface of the shield layer includes a patterned portion and a non-patterned portion other than the patterned portion, and a ratio of Sal (autocorrelation length) of the non-patterned portion to Sal of the patterned portion is as follows: (Sal of non-patterned portion)/(Sal of patterned portion)>4.0.
Claims13
A shield package comprising:
- a package in which an electronic component is sealed with a sealing material;
- and
- a shield layer covering the package,
- wherein a surface of the shield layer includes a patterned portion and a non-patterned portion other than the patterned portion, and
- a ratio of Sal of the non-patterned portion to Sal of the patterned portion is as follows:
- (Sal of non-patterned portion)/(Sal of patterned portion)>4.0, where Sal represents an autocorrelation length.
A shield package comprising:
- a package in which an electronic component is sealed with a sealing material;
- and
- a shield layer covering the package,
- wherein a surface of the shield layer includes a patterned portion and a non-patterned portion other than the patterned portion, and
- a ratio of Smr1 of the non-patterned portion to Smr1 of the patterned portion is as follows:
- (Smr1 of non-patterned portion)/(Smr1 of patterned portion)>1.0, where Smr1 represents a ratio of the area of the material at the intersection line which separates the protruding hills from the core surface to the evaluation area.
A shield package comprising:
- a package in which an electronic component is sealed with a sealing material;
- and
- a shield layer covering the package,
- wherein a surface of the shield layer includes a patterned portion and a non-patterned portion other than the patterned portion, and
- a ratio of Ssk of the non-patterned portion to Ssk of the patterned portion is as follows:
- (Ssk of non-patterned portion)/(Ssk of patterned portion)<5.0, where Ssk represents skewness.
(canceled)
Dependencies are inferred from the claim text.