Circuit board and method of manufacturing circuit board
AssigneesHongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., Avary Holding (Shenzhen) Co., Limited.
InventorJUN DAI
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Abstract
A circuit board includes a substrate, a first circuit layer, a second circuit layer, and a third circuit layer. The substrate includes a base layer, a first metal layer formed on the base layer, and a seed layer formed on the first metal layer. The first circuit layer is located on the substrate and includes the first metal layer and a signal layer formed on a surface of the first metal layer. The second circuit layer is coupled to the first circuit layer and includes the first metal layer, the seed layer, and a connection pillar formed on a surface of the first metal layer and the seed layer. The third circuit layer is coupled to the second circuit layer and includes the seed layer and a coil formed on a surface of the seed layer.
Claims15
A method of manufacturing a circuit board comprising a substrate, the method comprising:
- laminating a second film on a first metal layer and a seed layer located on a surface of a base layer of the substrate, the seed layer located on a surface of the first metal layer;
- exposing, developing, and electroplating the substrate to reveal the first metal layer, a portion of the first metal layer and the seed layer, and the seed layer, and forming a signal layer on the first metal layer, a connection pillar on the portion of the first metal layer and the seed layer, and a coil on the seed layer;
- removing the second film;
- etching the first metal layer between the signal layer and the connection pillar and the seed layer between the connection pillar and the coil to reveal portions of the base layer, thereby forming a first circuit layer from the signal layer, a second circuit layer from the connection pillar, and a third circuit layer from the coil.
A circuit board comprising:
- a substrate comprising a base layer, a first metal layer formed on the base layer, and a seed layer formed on the first metal layer;
- a first circuit layer located on the substrate and comprising the first metal layer and a signal layer formed on a surface of the first metal layer;
- a second circuit layer coupled to the first circuit layer and comprising the first metal layer, the seed layer, and a connection pillar formed on a surface of the first metal layer and the seed layer;
- and
- a third circuit layer coupled to the second circuit layer and comprising the seed layer and a coil formed on a surface of the seed layer.
A circuit board comprising:
- a substrate comprising a base layer, a first metal layer formed on the base layer, and a seed layer formed on the base layer;
- a first circuit layer located on the substrate and comprising the first metal layer and a signal layer formed on a surface of the first metal layer;
- a second circuit layer coupled to the first circuit layer and comprising the first metal layer, the seed layer, and a connection pillar formed on a surface of the first metal layer and the seed layer;
- and
- a third circuit layer coupled to the second circuit layer and comprising the seed layer and a coil formed on a surface of the seed layer.
Dependencies are inferred from the claim text.