Method for manufacturing component embedded circuit board

A method for manufacturing a component embedded circuit board, comprising:

• providing a printed circuit board, wherein the printed circuit board comprises a first opening and a first circuit layer, and the first circuit layer comprises at least one first connecting pad;
• mounting a component in the first opening and conductively connecting the component to the printed circuit board;
• providing a dielectric layer, defining a second opening in the dielectric layer, and embedding a conductive structure in the dielectric layer;
• wherein the second opening penetrates the dielectric layer;
• providing an antenna structure;
• wherein the antenna structure comprises a first ground layer;
• and
• pressing the antenna structure, the dielectric layer, and the printed circuit board with the component in that order;
• wherein the component is embedded in the first opening;
• one end of the conductive structure is connected to the first ground layer, and the other end of the conductive structure is connected to the first connecting pad;
• the second opening corresponds to the first opening, a gap is generated by the second opening and the component.