Printed circuit board
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsSeong Jae MUN, Jong Chan CHOI
Life of this patent
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Abstract
A printed circuit board includes an insulating layer; a metal pad disposed on one side of the insulating layer; a via hole penetrating through the insulating layer to expose at least a portion of the metal pad; and a via filling at least a portion of the via hole, wherein the via comprises a first metal layer and a second metal layer disposed on the first metal layer, and an average size of grains in the first metal layer and an average size of grains in the second metal layer are different from each other.
Claims20
A printed circuit board, comprising:
- an insulating layer;
- a metal pad disposed on one side of the insulating layer;
- a via hole penetrating through the insulating layer to expose at least a portion of the metal pad;
- and
- a via filling at least a portion of the via hole,
- wherein the via comprises a first metal layer and a second metal layer disposed on the first metal layer, and
- an average size of grains in the first metal layer and an average size of grains in the second metal layer are different from each other.
A printed circuit board, comprising:
- an insulating layer;
- a metal pad disposed on one side of the insulating layer;
- a via hole penetrating through the insulating layer to expose at least a portion of the metal pad;
- and
- a via filling at least a portion of the via hole,
- wherein the via comprises a first metal layer and a second metal layer comprising a first region and a second region and disposed on the first metal layer, and
- average sizes of grains in the first region and the second region of the second metal layer are different from each other.
A printed circuit board, comprising:
- an insulating layer;
- a metal pad disposed on one side of the insulating layer;
- a via hole penetrating through the insulating layer to expose at least a portion of the metal pad;
- and
- a via filling at least a portion of the via hole,
- wherein the via comprises a second metal layer comprising a first region and a second region and a third metal layer, and
- average sizes of grains in the first region and in the second region of the second metal layer are different from each other.
Dependencies are inferred from the claim text.