Substrate with electronic component embedded therein
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsSong I Kim, Mi Sun Hwang
Life of this patent
Estimating the term…
Abstract
A substrate with an electronic component embedded therein includes: a core layer having a through-portion; an electronic component disposed in the through-portion; an encapsulant disposed on a lower surface of the core layer, disposed in at least a portion of the through-portion, and covering at least a portion of a lower surface of the electronic component; and a build-up structure disposed on an upper surface of the core layer, and including a plurality of insulating layers, a plurality of wiring layers, and a plurality of via layers.
Claims23
A substrate with an electronic component embedded therein, comprising:
- a core layer having a through-portion;
- an electronic component disposed in the through-portion;
- an encapsulant disposed on a lower surface of the core layer, disposed in at least a portion of the through-portion, and covering at least a portion of a lower surface of the electronic component;
- and
- a build-up structure disposed on an upper surface of the core layer, and including a plurality of insulating layers, a plurality of wiring layers, and a plurality of via layers.
A substrate with an electronic component embedded therein, comprising:
- a core layer having a through-portion;
- an electronic component disposed in the through-portion;
- an encapsulant embedding at least a portion of the electronic component;
- and
- a build-up structure disposed on the core layer, and including a plurality of insulating layers, a plurality of wiring layers, and a plurality of via layers,
- wherein a via of a first via layer as one of the plurality of via layers, and a via of a second via layer as another one of the plurality of via layers, have a shape tapered in directions opposite to each other.
A substrate with an electronic component embedded therein, comprising:
- a core layer having a through-portion;
- an electronic component disposed in the through-portion and including a connection pad disposed on a first surface of the electronic component;
- an encapsulant extending to cover at least a portion of the first surface and at least a portion of a second surface of the electronic component opposing the first surface;
- and
- a build-up structure disposed on a surface of the core layer, and including a plurality of first insulating layers, a plurality of first wiring layers, and a plurality of via layers.
Dependencies are inferred from the claim text.