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US 2022/0030707 A1Published application
Laminated ceramic sintered body board for electronic device, electronic device, chip resistor, and method for manufacturing chip resistor
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsNORIMICHI NOGUCHI, MASATERU MIKAMI, KENJI TOYOSHIMA, HIROKI ODA, DAISUKE SUETSUGU, TATSUYA URAKAWA
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Abstract
A laminated ceramic sintered body board for an electronic device includes a ceramic sintered body board and a flattening film that is provided on an upper surface of the ceramic sintered body board and contains a thermally conductive filler, and the flattening film contains a thermally conductive filler.
Claims12
A laminated ceramic sintered body board for an electronic device, the laminated ceramic sintered body comprising:
- a ceramic sintered body board;
- and
- a flattening film that is provided on an upper surface of the ceramic sintered body board and contains a thermally conductive filler.
Dependencies are inferred from the claim text.