Rigid-flex printed circuit board and method for manufacturing the same

A method for manufacturing a rigid-flex printed circuit board, comprising:

• providing an inner circuit substrate, two adhesive sheet layers, and two shielding structures;
• wherein the inner circuit substrate is divided into a flexible area, a first rigid area, and a second rigid area;
• the first rigid area and the second rigid area are located on two ends of the flexible area;
• each shielding structure comprises a copper layer, a metal seed layer formed on the copper layer, a flexible dielectric layer formed on the metal seed layer, and a backing adhesive sheet layer formed on the flexible medium layer;
• pressing the two adhesive sheet layers on two opposite surfaces of the inner circuit substrate and pressing the two shielding structures on the two adhesive sheet layers and on the inner circuit substrate located in the flexible area;
• each of the two backing adhesive sheet layers is pressed on one of the two adhesive sheet layers and pressed on the inner circuit substrate located in the flexible area;
• and a metal seed layer is located in the flexible area, the first rigid area, and the second rigid area;
• the flexible dielectric layer is located in the flexible area, the first rigid area, and the second rigid area;
• and the backing adhesive sheet layer is located in the flexible area, the first rigid area, and the second rigid area;
• and
• forming two outer circuit layers on the copper layer by selective plating;
• wherein each of the two outer circuit layers is located in the first rigid area and the second rigid area and electrically connected to the inner circuit substrate.