Encapsulated printed circuit board assembly

Encapsulated printed circuit board assembly for electrical connection to a high- or medium-voltage power conductor in a power distribution network of a national grid, the printed circuit board assembly comprising:

• a) a printed circuit board (PCB), delimited by a peripheral edge and having a first major surface and an opposed second major surface, and comprising a high-tension pad, on the first major surface, wherein in use the high-tension pad is on a voltage of at least one kilovolt,
• b) an electrically insulating encapsulation body in surface contact with, and enveloping, the high-tension pad and at least a portion of the peripheral edge adjacent to the high-tension pad,
• c) a conductive low-voltage shielding layer, arranged on a first surface region of an external surface of the encapsulation body and for being held on electrical ground or on a low voltage to shield at least a low-voltage portion of the PCB,
• wherein the high-tension pad extends to the peripheral edge of the PCB.