Transversely-excited film bulk acoustic resonator package and method

A filter device comprising:

• an acoustic resonator chip comprising:
• a substrate;
• a piezoelectric plate having a back surface attached to a front surface of the substrate, portions of the piezoelectric plate forming a plurality of diaphragms spanning respective cavities in the substrate;
• a first conductor pattern on a front surface of the piezoelectric plate, the first conductor pattern including:
• a plurality of interdigitated transducers (IDTs) of a corresponding plurality of acoustic resonators, interleaved fingers of each of the IDTs on a respective diaphragm from the plurality of diaphragms, and
• a first plurality of contact pads;
• an interposer comprising a second conductor pattern, the second conductor pattern comprising a second plurality of contact pads on a back surface of the interposer;
• and
• a seal connecting a perimeter of the piezoelectric plate to a perimeter of the interposer, wherein
• each contact pad of the first plurality of contact pads is directly connected to a respective contact pad of the second plurality of contact pads.