Method for manufacturing a busbar and such a busbar
AssigneeRogers Corporation
InventorsWei Shi, Liang Tang
Life of this patent
Estimating the term…
Abstract
A method for manufacturing a busbar (1), in particular a laminated busbar (1), configured for mounting an electronic component, in particular a passive electronic component such as a capacitor, on the busbar (1), comprising: providing a first conductive layer (11) made from aluminum, providing a first connector element (15) for connecting the first conductive layer (11) and the electronic component, wherein the first connector element (15) is at least partially covered with nickel and/or tin, and creating an bond between the first conductive layer (11) and the first connector element (15) by laser welding.
Claims16
A method for manufacturing a busbar (1), configured for mounting an electronic component on the busbar (1), the method comprising:
- providing a first conductive layer (11) made from aluminum,
- providing a first connector element (15) for connecting the first conductive layer (11) and the electronic component, wherein the first connector element (15) is at least partially covered with nickel and/or tin, and
- creating a bond between the first conductive layer (11) and the first connector element (15) by laser welding.
Dependencies are inferred from the claim text.