US 2022/0029273 A1Published application

Module component, antenna module, and communication device

AssigneeMurata Manufacturing Co., Ltd.

InventorSaneaki ARIUMI

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Abstract

A module component includes a substrate having a first principal surface, a semiconductor substrate disposed on the first principal surface of the substrate, multiple terminals, and a resin layer. The terminals include multiple reference-potential terminals, which are electrically connected to the reference potential, and multiple signal terminals, which are disposed adjacent to at least one of the reference-potential terminals in the direction along an end portion of the substrate and which are supplied with a signal. In a plan view in the direction perpendicular to the first principal surface of the substrate, in at least one of the reference-potential terminals, the support portion is disposed between an end surface of the connection portion and the end portion of the substrate, and, in at least one of the signal terminals, the end surface of the connection portion is disposed between the support portion and the end portion of the substrate.

Claims20

Dependent claims

A module component comprising:

a substrate that has a first principal surface;
a semiconductor substrate that is disposed on the first principal surface of the substrate;
a plurality of terminals;
and
a resin layer, wherein
each of the plurality of terminals includes
a support portion that has a first surface and a second surface, the first surface extending in a direction perpendicular to the first principal surface, the second surface being opposite the first surface, the support portion being connected to the first principal surface on a first end of the support portion, and
a connection portion that is disposed as an integral unit with the first surface on a second end of the support portion, and that extends in a direction perpendicular to the first surface,
the resin layer covers at least a side surface of the semiconductor substrate, and covers the support portion and an end surface of the connection portion, the end surface being present in an extending direction of the connection portion,
the plurality of terminals include
a plurality of reference-potential terminals that are connected to a reference potential electrically, and
a plurality of signal terminals that are disposed adjacent to at least one of the plurality of reference-potential terminals in a direction along an end portion of the substrate, and that are supplied with a signal,
in a plan view in the direction perpendicular to the first principal surface of the substrate, in at least one of the plurality of reference-potential terminals, the support portion is disposed between the end surface of the connection portion and the end portion of the substrate, and
in the plan view, in at least one of the plurality of signal terminals, the end surface of the connection portion is disposed between the support portion and the end portion of the substrate.

11 more elements

An antenna module comprising:

a module component including
a substrate that has a first principal surface;
a semiconductor substrate that is disposed on the first principal surface of the substrate;
a plurality of terminals;
and
a resin layer, wherein
each of the plurality of terminals includes
a support portion that has a first surface and a second surface, the first surface extending in a direction perpendicular to the first principal surface, the second surface being opposite the first surface, the support portion being connected to the first principal surface on a first end of the support portion, and
a connection portion that is disposed as an integral unit with the first surface on a second end of the support portion, and that extends in a direction perpendicular to the first surface,
the resin layer covers at least a side surface of the semiconductor substrate, and covers the support portion and an end surface of the connection portion, the end surface being present in an extending direction of the connection portion,
the plurality of terminals include
a plurality of reference-potential terminals that are connected to a reference potential electrically, and
a plurality of signal terminals that are disposed adjacent to at least one of the plurality of reference-potential terminals in a direction along an end portion of the substrate, and that are supplied with a signal,
in a plan view in the direction perpendicular to the first principal surface of the substrate, in at least one of the plurality of reference-potential terminals, the support portion is disposed between the end surface of the connection portion and the end portion of the substrate, and
in the plan view, in at least one of the plurality of signal terminals, the end surface of the connection portion is disposed between the support portion and the end portion of the substrate;
a plurality of antenna devices that are disposed in the substrate;
and
a radio frequency integrated circuit that is disposed on the first principal surface of the substrate.

15 more elements

A communication device comprising:

an antenna module including
a module component including
a substrate that has a first principal surface;
a semiconductor substrate that is disposed on the first principal surface of the substrate;
a plurality of terminals;
and
a resin layer, wherein
each of the plurality of terminals includes
a support portion that has a first surface and a second surface, the first surface extending in a direction perpendicular to the first principal surface, the second surface being opposite the first surface, the support portion being connected to the first principal surface on a first end of the support portion, and
a connection portion that is disposed as an integral unit with the first surface on a second end of the support portion, and that extends in a direction perpendicular to the first surface,
the resin layer covers at least a side surface of the semiconductor substrate, and covers the support portion and an end surface of the connection portion, the end surface being present in an extending direction of the connection portion,
the plurality of terminals include
a plurality of reference-potential terminals that are connected to a reference potential electrically, and
a plurality of signal terminals that are disposed adjacent to at least one of the plurality of reference-potential terminals in a direction along an end portion of the substrate, and that are supplied with a signal,
in a plan view in the direction perpendicular to the first principal surface of the substrate, in at least one of the plurality of reference-potential terminals, the support portion is disposed between the end surface of the connection portion and the end portion of the substrate, and
in the plan view, in at least one of the plurality of signal terminals, the end surface of the connection portion is disposed between the support portion and the end portion of the substrate;
a plurality of antenna devices that are disposed in the substrate;
and
a radio frequency integrated circuit that is disposed on the first principal surface of the substrate;
and
a baseband integrated circuit that supplies a baseband signal to the antenna module.

18 more elements

Dependencies are inferred from the claim text.

Facts

Application: 17/496,811Filed 8 Oct 2021
Priority: JP 2019-08663326 Apr 2019
Published: 27 Jan 2022
Term ends: Not estimatedThe source records don’t support an estimate.

Classification12 codes

H01Q 1/2283
By structural association with other equipment or articles: mounted in or on the surface of a semiconductor substrate as a chip-type antenna or…
H01Q 3/385
The phase-shifters being digital: scan control logics
H05K 1/181
Structurally associated with non-printed electric components: associated with surface mounted components
H10W 44/20
Electrical arrangements for controlling or matching impedance: at high-frequency [HF] or radio frequency [RF]