Antenna Apparatus and Fabrication Method
AssigneeInfineon Technologies AG
InventorsEung San Cho, Ashutosh Baheti, Saverio Trotta
Life of this patent
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Abstract
A semiconductor device includes a semiconductor die comprising a radio frequency (RF) circuit, a first dielectric layer disposed over a first surface of the semiconductor die, an antenna layer disposed over a surface of the first dielectric layer, and an antenna feeding structure coupling the antenna layer to the RF circuit of the semiconductor die, wherein the semiconductor die comprises a via, and the antenna feeding structure comprises a first portion arranged within the opening of the semiconductor die and extending to the first surface of the semiconductor die, and a second portion arranged through the first dielectric layer.
Claims20
A semiconductor device comprising:
- a semiconductor die comprising a radio frequency (RF) circuit;
- a first dielectric layer disposed over a first surface of the semiconductor die;
- an antenna layer disposed over a surface of the first dielectric layer;
- and
- an antenna feeding structure coupling the antenna layer to the RF circuit of the semiconductor die, wherein:
- the semiconductor die comprises an opening;
- and
- the antenna feeding structure comprises a first portion arranged within the opening of the semiconductor die and extending to the first surface of the semiconductor die, and a second portion arranged through the first dielectric layer.
A method comprising:
- forming a via in a semiconductor die comprising a radio frequency (RF) circuit;
- depositing a first dielectric layer over a first surface of the semiconductor die;
- forming a first via in the first dielectric layer;
- and
- forming an antenna layer on a first surface of the first dielectric layer, wherein an antenna feeding structure is configured to couple the RF circuit to the antenna layer, and wherein the antenna feeding structure comprises a first portion formed by the via of the semiconductor die and extending to the first surface of the semiconductor die, and a second portion formed by in the first via.
A system comprising:
- a semiconductor die comprising a via and a radio frequency (RF) circuit;
- a first dielectric layer disposed over a first surface of the semiconductor die;
- an antenna layer disposed over a surface of the first dielectric layer;
- and
- an antenna feeding structure comprising a first portion formed by the via of the semiconductor die, and a second portion within the first dielectric layer, wherein the antenna layer is coupled to the RF circuit of the semiconductor die through the antenna feeding structure.
Dependencies are inferred from the claim text.