High powered rf part for improved manufacturability
AssigneeTTM Technologies, Inc.
InventorsMichael Len, Hans Peter Ostergaard
Life of this patent
Estimating the term…
Abstract
An electrical component, such as an RF device or thermal bridge, for use with a printed circuit board. The component has a first dielectric layer having a top and a bottom, a first conductive trace positioned on the bottom of the dielectric layer, and a first ground layer positioned on the bottom of the dielectric layer and spaced apart from the first conductive trace. For RF applications, a second conductive trace is positioned on top of first dielectric, a second dielectric is positioned on top of the second conductive trace, and a second ground plane is positioned on top of the second dielectric. A printed circuit board having a third conductive trace may then be coupled to the first conductive trace by a first solder layer.
Claims20
An electrical component for a printed circuit board, comprising:
- a first dielectric layer having a top and a bottom;
- a first conductive trace positioned on the bottom of the first dielectric layer;
- a first ground layer positioned on the bottom of the first dielectric layer and spaced apart from the first conductive trace, wherein the first conductive trace is aligned with a second conductive trace of the printed circuit board along a full length of the first conductive trace;
- a first solder layer connecting the first conductive trace to the second conductive trace of the printed circuit board and extending the full length of the first conductive trace;
- and
- a third conductive trace over the top of the first dielectric layer.
An electrical component for a printed circuit board, comprising:
- a first dielectric layer having a top and a bottom;
- a first conductive trace positioned on the bottom of the first dielectric layer;
- a first ground layer positioned on the bottom of the first dielectric layer and spaced apart from the first conductive trace, wherein the first conductive trace is aligned with a second conductive trace of the printed circuit board along a full length of the first conductive trace;
- a second dielectric layer positioned on top of the third conductive trace;
- and
- a first solder layer connecting the first conductive trace to the second conductive trace of the printed circuit board, wherein the electrical component has a thermal path comprising the first conductive trace, the first dielectric layer, the first ground layer, the first solder layer, and an upper ground layer of the printed circuit board.
Dependencies are inferred from the claim text.