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US 2022/0029133 A1Published application
Encapsulation composition
AssigneeLG Chem, Ltd.
InventorsSeung Min LEE, Yeong Bong MOK, Sung Nam MOON, Se Woo YANG
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Abstract
The present disclosure relates to an encapsulation composition, an encapsulation film comprising the same, an organic electronic device comprising the same, and a method for manufacturing an organic electronic device using the same, which provides an encapsulation composition capable of effectively blocking moisture or oxygen introduced into an organic electronic device from the outside and realizing an organic electronic device with an extremely small bezel part structure.
Claims20
An encapsulation composition comprising:
- an encapsulation resin comprising an olefinic resin, and
- a moisture adsorbent surface-treated with an aliphatic hydrocarbon compound.
Dependencies are inferred from the claim text.