Light-emitting diode chip and method for manufacturing the same
AssigneeXiamen Sanan Optoelectronics Technology Co., Ltd.
InventorsGONG CHEN, SU-HUI LIN, SHENG-HSIEN HSU, KANG-WEI PENG, LING-YUAN HONG, MINYOU HE, CHIA-HUNG CHANG
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Abstract
A light-emitting diode chip includes a substrate. The substrate has a side surface configured as a serrated surface, which includes a plurality of laser inscribed features disposed along a thickness direction of the substrate and spaced apart from each other. A method for manufacturing the light-emitting diode chip is also disclosed herein.
Claims18
A light-emitting diode chip, comprising:
- a substrate which has a side surface configured as a serrated surface, which includes a plurality of laser inscribed features disposed along a thickness direction of said substrate and spaced apart from each other.
A method for manufacturing a light-emitting diode chip, comprising a step of i) forming a plurality of laser inscribed features by stealth dicing in a portion of substrate of light-emitting structure corresponding to a dicing street of the light-emitting structure, the laser inscribed features being spaced apart from each other in a thickness direction of the substrate.
Dependencies are inferred from the claim text.