3d architecture of ternary content-addressable memory method for the same
AssigneeMacronix International Co., Ltd.
InventorLiang-Yu CHEN
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AssigneeMacronix International Co., Ltd.
InventorLiang-Yu CHEN
Estimating the term…
Disclosed is a 3D architecture of ternary content-addressable memory (TCAM), comprising a first transistor layer, a second transistor layer, a third transistor layer and a fourth transistor layer. The first transistor layer and the second transistor layer are disposed on a first plane. The third transistor layer and the fourth transistor layer are respectively stacked on the first transistor layer and the second transistor layer in a second direction perpendicular to the first plane. Two of the first transistor layer, the second transistor layer, the third transistor layer and the fourth transistor layer are a first transistor and a second transistor of a first memory cell of the TCAM. The other two of the first transistor layer, the second transistor layer, the third transistor layer and the fourth transistor layer are a first transistor and a second transistor of a second memory cell of the TCAM.
A 3D architecture of ternary content-addressable memory (TCAM), comprising:
A 3D architecture of ternary content-addressable memory (TCAM), comprising:
Dependencies are inferred from the claim text.