Semiconductor device package and method of manufacturing the same

A semiconductor device package, comprising:

• a substrate having a first surface and a second surface opposite to the first surface;
• a connection structure disposed on the first surface of the substrate;
• a package body disposed on the first surface of the substrate, the package body partially covering the connection structure, wherein a portion of the connection structure is exposed from the package body;
• a shielding layer disposed at a first side and a second side of the package body and exposing the portion of the connection structure;
• and
• a first electronic component disposed on the second surface of the substrate.

A semiconductor device package, comprising:

• a substrate having a first surface and a second surface opposite to the first surface;
• a connection structure disposed on the first surface of the substrate;
• a package body disposed on the first surface of the substrate, the package body partially covering the connection structure, wherein a portion of the connection structure is exposed from the package body;
• and
• a first electronic component disposed on the second surface of the substrate and at least partially disposed under the connection structure.