Semiconductor memory device and method for driving the same
AssigneeKioxia Corporation
InventorsTakuro OKUBO, Hidekazu HAYASHI
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Abstract
A manufacturing method of a semiconductor device according to an embodiment comprises, bonding a first semiconductor substrate and a second semiconductor substrate to form a stack, filling a first fill material having a first viscosity in a gap located between an outer peripheral portion of the first semiconductor substrate and an outer peripheral portion of the second semiconductor substrate, filling a second fill material having a second viscosity higher than the first viscosity in the gap so as to be adjacent to the first fill material after filling the first fill material in the gap and thinning the second semiconductor.
Claims17
A semiconductor device manufacturing method, comprising:
- bonding a first semiconductor substrate and a second semiconductor substrate, to form a stack;
- filling a first fill material having a first viscosity in a gap located between an outer peripheral portion of the first semiconductor substrate and an outer peripheral portion of the second semiconductor substrate;
- filling a second fill material having a second viscosity higher than the first viscosity in the gap so as to be adjacent to the first fill material after filling the first fill material in the gap;
- and
- thinning the second semiconductor substrate.
A semiconductor device, comprising:
- a first semiconductor substrate;
- a second semiconductor substrate bonded with the first semiconductor substrate to form a stack and being thinner than the first semiconductor substrate;
- a gap provided between an outer peripheral portion of the first semiconductor substrate and an outer peripheral portion of the second semiconductor substrate;
- a first fill material provided in the gap and having a first viscosity, and
- a second fill material provided in the gap adjacent to the first fill material and having a second viscosity higher than the first viscosity.
Dependencies are inferred from the claim text.