Semiconductor module and semiconductor device

A semiconductor device comprising a main substrate, a semiconductor module including at least one semiconductor element and mounted on a first surface of the main substrate, and a plurality of circuit elements mounted on the main substrate, wherein:

• the circuit elements include a first circuit element mounted on the first surface, and a second circuit element mounted on a second surface on an opposite side from the first surface;
• the semiconductor module includes a plurality of connection terminals disposed in a shape of a plurality of rectangular rings on a side of a facing surface that faces the main substrate to be connected to the main substrate;
• the plurality of connection terminals include a first connection terminal group composed of a plurality of first connection terminals to be connected to the first circuit element via the main substrate, and a second connection terminal group composed of a plurality of second connection terminals to be connected to the second circuit element via the main substrate;
• and
• the first connection terminal group is disposed on an outer peripheral side with respect to the second connection terminal group.