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US 2022/0028819 A1Published application
Package process, daf replacement
AssigneeWestern Digital Technologies, Inc.
InventorsSiqi ZHANG, Xu WANG, Pradeep RAI, Shrikar BHAGATH
Life of this patent
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Abstract
A method is disclosed herein. The method includes dicing a wafer and applying a mask. The method includes spraying die bond material, at a first temperature, to a surface of the wafer and cooling the die bond material at a second temperature to at least partially solidify the die bond material. The method also includes removing the mask from the wafer through the die bond material. After the removing of the mask, the method includes curing the die bond material to form a die attach film layer on the wafer.
Claims20
A method comprising:
- dicing a wafer;
- applying a mask;
- spraying die bond material, at a first temperature, to a surface of the wafer;
- cooling the die bond material at a second temperature to at least partially solidify the die bond material;
- removing the mask from the wafer through the die bond material;
- and
- after the removing of the mask, curing the die bond material to form a die attach film layer on the wafer,
4 more elements
A die stack comprising:
- a first die;
- a second die;
- and
- a die attach film layer disposed between the first die and the second die, wherein the die attach film layer comprises a thickness along a range of 2 μM to 5 μm.
1 more element
Dependencies are inferred from the claim text.