Semiconductor device and manufacturing method for semiconductor device

A semiconductor device comprising:

• a first insulating layer having a first surface and a second surface facing away from each other in a thickness direction;
• a plurality of first conductors each having a first embedded part and a first redistribution part, at least a portion of the first embedded part being embedded in the first insulating layer, the first redistribution part being disposed at the second surface and connected to the first embedded part;
• a semiconductor element that is in contact with the first surface and has a plurality of electrodes, the electrodes being provided near the first surface and connected to at least a predetermined number of the first embedded parts of the first conductors;
• and
• a sealing resin that is in contact with the first surface and covers a portion of the semiconductor element;
• wherein the first redistribution parts of the first conductors include portions located outside the semiconductor element as viewed in the thickness direction,
• the first insulating layer has a plurality of first grooves recessed from the second surface in the thickness direction, and
• the first redistribution parts of the first conductors are in contact with the first grooves.