Redistribution layer connection
AssigneeQUALCOMM Incorporated
InventorsAniket PATIL, Hong Bok WE, Marcus HSU
Life of this patent
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Abstract
Examples herein include die to metallization structure connections that eliminate the solder joint to reduce the resistance and noise on the connection. In one example, a first die is attached to a metallization layer by a plurality of copper interconnections and a second is attached to the metallization layer opposite the first die through another plurality of copper interconnections. In this example, the copper interconnects may connect the respective die to a metallization structure in the metallization layer.
Claims30
A package comprising:
- a metallization layer;
- a first die electrically coupled to a first side of the metallization layer;
- a second die electrically coupled to a second side of the metallization layer opposite the first side of the metallization layer;
- a first plurality of copper interconnections between the first die and the metallization layer;
- and
- a second plurality of copper interconnections between the second die and the metallization layer.
A package comprising:
- a metallization layer;
- a first die electrically coupled to a first side of the metallization layer;
- a second die electrically coupled to a second side of the metallization layer opposite the first side of the metallization layer;
- first means for interconnection between the first die and the metallization layer;
- and
- second means for interconnection between the second die and the metallization layer.
A method for manufacturing a package, the method comprising:
- forming a metallization layer;
- forming a first plurality of copper interconnections on a first side of the metallization layer;
- forming a second plurality of copper interconnections on a second side of the metallization layer opposite the first side of the metallization layer;
- electrically coupling a first die to the first plurality of copper interconnections;
- and
- electrically coupling a second die to the second plurality of copper interconnections.
Dependencies are inferred from the claim text.