Semiconductor device
AssigneeKioxia Corporation
InventorSatoru TAKAKU
Life of this patent
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Abstract
A semiconductor device includes an insulating substrate, a wiring, a semiconductor chip and a resin layer. The wiring is provided on the insulating substrate. The wiring board includes (i) an insulating material and (ii) a pad exposed relative to the insulating material and electrically connected to the wiring. A height of the insulating material in a vertical direction of the wiring board varies along the wiring board. The semiconductor chip includes a bump connected to the pad on a first surface of the semiconductor chip. The resin layer covers a periphery of the bump between the wiring board and the semiconductor chip.
Claims20
A semiconductor device comprising:
- an insulating substrate;
- a wiring provided on the insulating substrate;
- a wiring board including:
- (i) an insulating material and (ii) a pad exposed relative to the insulating material and electrically connected to the wiring, a height of the insulating material in a vertical direction of the wiring board varying along the wiring board;
- a semiconductor chip including a bump connected to the pad on a first surface of the semiconductor chip;
- and
- a resin layer covering a periphery of the bump between the wiring board and the semiconductor chip.
Dependencies are inferred from the claim text.