Semiconductor device packages with angled pillars for decreasing stress
AssigneeMicron Technology, Inc.
InventorShams U. Arifeen
Life of this patent
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Abstract
Semiconductor devices having mechanical pillar structures, such as angled pillars, that are rectangular and oriented with respect to a semiconductor die to reduce bending stress and in-plane shear stress at a semiconductor die to which the angled pillars are attached, and associated systems and methods, are disclosed herein. The semiconductor device can include angled pillars coupled to the semiconductor die and to a package substrate. The angled pillars can be configured such that they are oriented relative to a direction of local stress to increase section modulus.
Claims20
A semiconductor device, comprising:
- a package substrate;
- a semiconductor die including integrated circuitry, active bond pads electrically coupled to the integrated circuitry, and inactive bond areas electrically isolated from the integrated circuitry, wherein the semiconductor die has an active surface with a major reference axis, a minor reference axis normal to the major reference axis, and a die center coordinate;
- and
- angled pillars between the substrate and the semiconductor die, wherein the angled pillars have a non-circular cross-sectional shape with a major pillar axis, a minor pillar axis, and a pillar center coordinate, and wherein the major pillar axis is oriented at least approximately normal to a direction of local stress at the angled pillars.
A method of forming a semiconductor device, the method comprising:
- forming angled pillars on a semiconductor die, the semiconductor die including integrated circuitry, active bond pads electrically coupled to the integrated circuitry, and inactive bond areas electrically isolated from the integrated circuitry,
- wherein the semiconductor die has an active surface with a major reference axis, a minor reference axis normal to the major reference axis, and a die center coordinate,
- wherein the angled pillars have a non-circular cross-sectional shape with a major pillar axis, a minor pillar axis, and a pillar center coordinate, and
- wherein the major pillar axis is oriented based on a direction of local stress at the angled pillar;
- and
- attaching the angled pillars to a package substrate.
A semiconductor device, comprising:
- a package substrate including circuit elements;
- a semiconductor die including integrated circuitry, active bond pads electrically coupled to the integrated circuitry, and inactive bond areas electrically isolated from the integrated circuitry, wherein the semiconductor die also has a lengthwise dimension and a widthwise dimension;
- and
- angled pillars between the substrate and the semiconductor die, wherein the angled pillars have a non-circular cross-sectional shape with a first dimension, a second dimension normal to the first dimension and less than the first dimension, and a pillar center coordinate, and wherein the second dimension of each angled pillar is oriented based on a direction of local stress at the angled pillar.
Dependencies are inferred from the claim text.