Single-Shot Encapsulation
AssigneeSemtech Corporation
InventorsKok Khoon Ho, Jonathan Clark, John MacLeod
Life of this patent
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Abstract
A semiconductor device includes a semiconductor wafer. A plurality of pillar bumps is formed over the semiconductor wafer. A solder is deposited over the pillar bumps. The semiconductor wafer is singulated into a plurality of semiconductor die after forming the pillar bumps while the semiconductor wafer is on a carrier. An encapsulant is deposited around the semiconductor die and pillar bumps while the semiconductor die remains on the carrier. The encapsulant covers an active surface of the semiconductor die between the pillar bumps.
Claims25
A method of making a semiconductor device, comprising:
- providing a semiconductor wafer;
- forming a plurality of pillar bumps over the wafer;
- singulating the semiconductor wafer into a plurality of semiconductor die;
- and
- depositing an encapsulant over the semiconductor die with the pillar bumps exposed from the encapsulant.
A method of making a semiconductor device, comprising:
- providing a semiconductor die;
- forming a pillar bump over the semiconductor die;
- forming a solder cap over the pillar bump;
- and
- depositing an encapsulant over the semiconductor die, pillar bump, and solder cap.
A semiconductor device, comprising:
- a semiconductor die;
- a pillar bump formed over the semiconductor die;
- a solder cap formed over the pillar bump;
- and
- an encapsulant deposited over the semiconductor die, pillar bump, and solder cap, wherein a surface of the solder cap is coplanar with a surface of the encapsulant.
A semiconductor device, comprising:
- a semiconductor die;
- a pillar bump formed over the semiconductor die;
- a solder cap formed over the pillar bump;
- and
- an encapsulant deposited over the semiconductor die, pillar bump, and solder cap.
Dependencies are inferred from the claim text.