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US 2022/0028809 A1Published application
Electronic substrate and electronic device
AssigneeInnolux Corporation
InventorsChueh Yuan Nien, Chao-Chin Sung, Chia-Hung Hsieh, Mei Cheng Liu
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Abstract
An electronic substrate and an electronic device are provided. The electronic substrate includes a base, a protruding portion, and a bonding pad. The protruding portion and the bonding pad are disposed on the base. The bonding pad is not overlapped with a boundary of the protruding portion.
Claims20
An electronic substrate, comprising:
- a base;
- a protruding portion disposed on the base;
- and
- a bonding pad disposed on the base;
- wherein the bonding pad is not overlapped with a boundary of the protruding portion.
2 more elements
An electronic device, comprising:
- an electronic substrate, comprising:
- a base;
- a protruding portion disposed on the base;
- and
- a bonding pad disposed on the base, wherein the bonding pad is not overlapped with a boundary of the protruding portion;
- and
- an electronic element electrically connected to the bonding pad of the electronic substrate.
4 more elements
Dependencies are inferred from the claim text.