Semiconductor device and electronic device

A semiconductor device, comprising:

• a first substrate including a pixel region having a plurality of pixels;
• a second substrate bonded to the first substrate at a bonding interface;
• and
• at least one guard structure disposed in the first and second substrates and outside of the pixel region, the at least one guard structure including:
• a first guard element disposed in a first surface of the first substrate that is opposite the bonding interface;
• a second guard element disposed in a first surface of the second substrate that is opposite the bonding interface;
• and
• a third guard element including a first bonding portion disposed in the first substrate at the bonding interface and spaced apart from the first guard element by a portion of the first substrate, and a second bonding portion disposed in the second substrate at the bonding interface and spaced apart from the second guard element by a portion of the second substrate,
• wherein the first ponding portion and the second bonding portion are bonded to one another, and
• wherein the first guard element, the second guard element, and the third guard element overlap one another in a plan view.

A semiconductor device, comprising:

• a first substrate including a first chip area having a first pixel region;
• a second substrate bonded to the first substrate at a bonding interface and including circuitry that processes signals from the first pixel region;
• and
• a plurality of guard structures disposed in the first and second substrates that protect the first chip area from at least one of chipping and cracking when the first chip area is separated from a second chip area, each of the plurality of guard structures including:
• a first guard element disposed in a first surface of the first substrate that is opposite the bonding interface;
• a second guard element disposed in a first surface of the second substrate that is opposite the bonding interface;
• and
• a third guard element including a first bonding portion disposed in the first substrate at the bonding interface and spaced apart from the first guard element by a portion of the first substrate, and a second bonding portion disposed in the second substrate at the bonding interface and spaced apart from the second guard element by a portion of the second substrate.