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US 2022/0028799 A1Published application
Module and method of manufacturing the same
AssigneeMurata Manufacturing Co., Ltd.
InventorsToru Komatsu, Tadashi Nomura
Life of this patent
Estimating the term…
Abstract
A module is disclosed that includes a substrate having a first main surface, a first component mounted on the first main surface, a first sealing resin disposed so as to cover the first main surface and the first component, a marking film covering at least an upper surface of the first sealing resin, and a shield film covering the marking film. An upper surface of the marking film is locally formed with a first recess.
Claims20
A module comprising:
- a substrate having a first main surface;
- a first component mounted on the first main surface;
- a first sealing resin disposed to cover the first main surface and the first component;
- a marking film covering at least an upper surface of the first sealing resin and having an upper surface opposite the first sealing resin that comprises a first recess locally disposed therein;
- and
- a shield film covering the marking film.
3 more elements
A module comprising:
- a substrate having a main surface;
- an electronic component mounted on the main surface of the substrate;
- a sealing resin that covers the main surface of the substrate and the electronic component;
- a marking film that covers the sealing resin opposite the substrate and that has an surface opposite the sealing resin that includes a first recess extending therein towards the sealing resin;
- and
- a shield film that covers the marking film and includes a surface opposite the marking film with a second recess that aligns with the first recess of the marking film.
3 more elements
A method of manufacturing a module, the method comprising:
- preparing a collective substrate;
- mounting a first component on a first main surface of the collective substrate;
- disposing a first sealing resin to cover the first main surface and the first component;
- forming a marking film to cover an upper surface of the first sealing resin;
- forming a first recess by irradiating an upper surface of the marking film with a laser beam;
- cutting the collective substrate into a plurality of module blanks;
- and
- forming a shield film on each of the plurality of module blanks to cover an upper surface and a side surface thereof.
5 more elements
Dependencies are inferred from the claim text.