Semiconductor packages with integrated shielding
AssigneeUTAC Headquarters Pte. Ltd.
InventorsSaravuth SIRINORAKUL, Il Kwon SHIM, Kok Chuen LOCK, Roel Adeva ROBLES, Eakkasit DUMSONG
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Abstract
The present disclosure is directed to improving EMI shielding to provide more reliable semiconductor packages. The semiconductor package may be, for example, a lead frame including one or multiple dies attached thereto. The semiconductor package may include only wire bonds or a combination of clip bonds and wire bonds. An integrated shielding structure may be disposed in between the package substrate and the encapsulant to shield internal and/or external EMI. For example, a top surface of the integrated shield structure is exposed.
Claims20
A method for forming a device comprising:
- providing a package substrate configured with a die attach pad (DAP) and package pads;
- attaching a die to the DAP, wherein the die is electrically coupled to the package pads;
- and
- attaching an electromagnetic interference (EMI) shield structure to the package substrate, the EMI shield structure is disposed over the die on the DAP, wherein the EMI shield structure is electrically coupled to ground.
A device comprising:
- a package substrate having a die attach pad (DAP) and package pads;
- a die disposed on the DAP, the die is electrically coupled to the package pads;
- and
- an electromagnetic interference (EMI) shield structure, the EMI shield structure comprises a planar member covering the die, wherein the EMI shield structure is electrically coupled to ground.
Dependencies are inferred from the claim text.