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US 2022/0028795 A1Published application
Ruthenium liner and cap for back-end-of-line applications
AssigneeApplied Materials, Inc.
InventorsWenjing Xu, Feng Chen, Tae Hong Ha, Xianmin Tang, Lu Chen, Zhiyuan Wu
Life of this patent
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Abstract
Electronic devices and methods of forming electronic devices using a ruthenium or doped ruthenium liner and cap layer are described. A liner with a ruthenium layer and a cobalt layer is formed on a barrier layer. A conductive fill forms a second conductive line in contact with the first conductive line.
Claims20
An electronic device comprising:
- a first conductive line extending along a first direction;
- a dielectric material formed on a substrate surface on the first conductive line, the dielectric material having a top surface with a surface structure formed in a surface of the dielectric material, the surface structure having sidewalls and a via bottom, the via bottom comprising a top surface of the first conductive line;
- a barrier layer formed on the top surface of the dielectric material and the sidewalls;
- a liner formed on the barrier layer, the liner having a liner bottom surface spaced a distance from the top surface of the first conductive line;
- and
- a conductive fill within the surface structure, the conductive fill forming a second conductive line extending along a second direction, the conductive fill contacting the first conductive line.
3 more elements
A method of forming an electronic device, the method comprising:
- forming a passivation layer in a via portion of surface structure formed in a dielectric material, the passivation layer formed on a surface of a first conductive material and separated from the dielectric material by a barrier layer formed on sidewalls, a bottom of a trench portion of the surface structure and a top of the dielectric material, the first conductive material extending along a first direction;
- forming a liner on the barrier layer, the liner having a liner bottom surface contacting the passivation layer in the via portion;
- removing the passivation layer to leave the bottom surface of the liner spaced a distance from a top surface of the first conductive line;
- filling the surface structure with a conductive fill to form a via in the via portion and a second conductive line in the trench portion, the second conductive line extending along a second direction, the via contacting the first conductive line in the via portion;
- and
- forming a cap layer on the conductive fill.
3 more elements
Dependencies are inferred from the claim text.