Through electrode substrate and mounting substrate

A through electrode substrate comprising:

• a first side of the through electrode substrate;
• a second side of the through electrode substrate opposite the first side;
• a substrate including a first surface facing the first side, and a second surface facing the second side, the substrate being provided with a through hole;
• a through electrode positioned in the through hole of the substrate, the through electrode having a first end surface facing the first side and a second end surface facing the second side;
• and
• a first wiring structure including at least a first wiring layer positioned on the first surface of the substrate, and a second wiring layer positioned on the first wiring layer;
• wherein:
• the first wiring layer has a first insulation layer provided with a first opening positioned on the first end surface of the through electrode, and a first electroconductive layer connected to the first end surface of the through electrode through the first opening of the first insulation layer;
• the second wiring layer has a second insulation layer provided with a second opening positioned on the first electroconductive layer of the first wiring layer, and a second electroconductive layer connected to the first electroconductive layer of the first wiring layer through the second opening of the second insulation layer;
• the through electrode includes a sidewall portion and a first portion, the sidewall portion extending along a sidewall of the through hole, the first portion extending along a plane direction of the first surface;
• the electroconductive layer of the first wiring layer is connected to the first portion at a position overlapped with the through hole of the substrate when seen along the normal direction of the first surface of the substrate;
• the first insulation layer of the first wiring layer includes at least an organic layer;
• at least any one layer selected from the group of the first insulation layer of the first wiring layer, the second insulation layer of the second wiring layer, and a layer of the first wiring structure not included in the first wiring layer and the second wiring layer, includes an inorganic layer having insulation properties;
• and
• the inorganic layer is positioned toward the first side relative to the organic layer of the first insulation layer of the first wiring layer.