Method of manufacturing semiconductor devices and corresponding semiconductor device

A semiconductor device, comprising:

• at least one semiconductor chip mounted on a leadframe;
• a laser direct structuring material molding on said at least one semiconductor chip;
• said laser direct structuring material molding providing at least one portion of an insulating package for the at least one semiconductor chip, the at least one portion of the insulating package having an outer surface;
• an opening extending through the molded laser direct structuring material molding to at least one contact of said at least one semiconductor chip;
• an electrically conductive material in said opening to form at least one electrically conductive formation extending between the outer surface of the at least one portion of the insulating package and the at least one semiconductor chip;
• a mounting paddle on the outer surface of the at least one portion of the insulating package and in contact with said at least one electrically conductive formation;
• an electrically conductive clip applied onto the mounting paddle at the outer surface of the at least one portion of the insulating package, said electrically conductive clip being electrically coupled to said at least one semiconductor chip through the at least one electrically conductive formation;
• and
• an electrically connection of the electrically conductive clip to the leadframe, where the at least one semiconductor chip is located intermediate the leadframe and the electrically conductive clip.

A semiconductor device, comprising:

• a semiconductor chip mounted to a leadframe;
• a contact stud bump on the semiconductor chip;
• a laser direct structuring material molding on said semiconductor chip and said contact stud bump;
• a hole extending through the laser direct structuring material molding, wherein said hole reaches said contact stud bump;
• plating on sidewalls of the hole forming a via;
• a paddle on an upper surface of the molded laser direct structuring material, said paddle in contact with the via;
• an electrically conductive clip attached onto the paddle, wherein said electrically conductive clip is electrically coupled to the semiconductor chip through said via;
• and
• an electrical connection of the electrically conductive clip to the leadframe.