Semiconductor device packages and methods of assembling thereof
AssigneeInfineon Technologies Americas Corp.
InventorFranck Ergas
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes a power semiconductor device, a circuit board, and an insulating substrate. The power semiconductor device includes contact pads. Adjacent ones of the contact pads are separated by one of a plurality of gaps. The circuit board includes traces for coupling with the contact pads of the power semiconductor device. The contact pads are physically attached to the traces. The insulating substrate is disposed between the circuit board and the power semiconductor device, where portions of the insulating substrate are disposed in the plurality of gaps, and where the insulating substrate has a monolithic structure.
Claims20
A semiconductor device comprising:
- a power semiconductor device comprising contact pads, adjacent ones of the contact pads being separated by one of a plurality of gaps;
- a circuit board comprising traces for coupling with the contact pads of the power semiconductor device, the contact pads being physically attached to the traces;
- and
- an insulating substrate disposed between the circuit board and the power semiconductor device, wherein portions of the insulating substrate are disposed in the plurality of gaps, and wherein the insulating substrate has a monolithic structure.
A semiconductor device comprising:
- an enhanced mode GaN power transistor configured to operate at an operating voltage between 20 V and 1000 V and comprising contact pads;
- a printed circuit board configured to support operating voltage and comprising contact surfaces for coupling with the contact pads of the enhanced mode GaN power transistor;
- and
- a rigid insulating substrate disposed between the printed circuit board and the enhanced mode GaN power transistor, the contact pads being physically attached to the contact surfaces through a plurality of through holes in the rigid insulating substrate.
A method of assembling a semiconductor device, the method comprising:
- placing an insulating substrate over a circuit board, the insulating substrate comprising an insulating material and being a monolithic structure;
- placing a power semiconductor device over the circuit board and the insulating substrate, wherein contact pads of the power semiconductor device are aligned with traces for attaching the contact pads of the power semiconductor device on the circuit board, and wherein adjacent ones of the contact pads are separated by one of a plurality of gaps;
- and
- heating the circuit board and the power semiconductor device to cure the insulating substrate and attach the contact pads with the traces.
Dependencies are inferred from the claim text.