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US 2022/0028767 A1Published application
Surface mount package for a semiconductor device
AssigneeTexas Instruments Incorporated
InventorsNaweed Anjum, Michael Gerald Amaro, Makarand Ramkrishna Kulkarni
Life of this patent
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Abstract
A lead for a surface mount package for a semiconductor device, and the surface mount package employing the same. In one example, the lead includes a central segment with a first side and a second side, a first extension from a portion of the first side, and a second extension from a portion of the second side. The lead also includes a recess extending through a portion of the central segment, the first extension and the second extension.
Claims20
A lead of a semiconductor package, comprising:
- a central segment having a first side and a second side;
- a first extension from a portion of the first side;
- a second extension from a portion of the second side;
- and
- a recess extending through a portion of the central segment, the first extension and the second extension.
2 more elements
A package, comprising:
- a semiconductor die attached to a die attach pad;
- and
- a lead coupled to the semiconductor die and terminating on a first surface and an adjacent second surface of the package, including:
- a central segment having a first side and a second side;
- a first extension from a portion of the first side;
- a second extension from a portion of the second side;
- and
- a recess extending through a portion of the central segment, the first extension and the second extension of the lead, a portion of the lead being exposed from a molding compound covering the semiconductor die.
5 more elements
Dependencies are inferred from the claim text.