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US 2022/0028765 A1Published application
Coated semiconductor devices
AssigneeTexas Instruments Incorporated
InventorSreenivasan Kalyani KODURI
Life of this patent
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Abstract
In examples, a semiconductor device comprises a semiconductor die, an opaque mold compound housing covering the semiconductor die, a conductive terminal extending from the mold compound housing, and an insulative coat covering the mold compound housing and at least a portion of the conductive terminal.
Claims30
A semiconductor device, comprising:
- a semiconductor die;
- an opaque mold compound housing covering the semiconductor die;
- a conductive terminal extending from the mold compound housing;
- and
- an insulative coat covering the mold compound housing and at least a portion of the conductive terminal.
2 more elements
An electronic device, comprising:
- a printed circuit board (PCB);
- a semiconductor device including an opaque mold compound housing and a conductive terminal extending from the mold compound housing, the conductive terminal having a first bend and a second bend and terminating at an end;
- an insulative coat covering the mold compound housing and covering at least a first length of the conductive terminal between the mold compound housing and a point between the first and second bends;
- and
- a metal joint coupled to the PCB and the conductive terminal, the metal joint covering the second bend and the end of the conductive terminal.
2 more elements
A semiconductor device, comprising:
- a semiconductor die;
- an opaque plastic housing covering the semiconductor die;
- a conductive terminal extending from the plastic housing and including a bend;
- and
- a coat covering a surface of the plastic housing.
2 more elements
A method, comprising:
- providing a semiconductor device having a plastic housing and a conductive terminal extending from the plastic housing;
- covering the plastic housing and the conductive terminal with an insulative coat;
- performing a first curing of the insulative coat;
- using a solvent to remove the insulative coat from a portion of the conductive terminal;
- and
- performing a second curing of the insulative coat covering the plastic housing and the conductive terminal.
3 more elements
Dependencies are inferred from the claim text.