Evaporative microchip cooling

A method of cooling a microchip, which microchip comprises an integrated circuit and is provided with a cooling system, wherein the cooling system comprises a cooling element and the microchip is assembled or integrated with the cooling element, wherein the cooling element comprises:

• a vaporization chamber comprising a heat exchanging wall, wherein the microchip is arranged adjacent to a first side of said heat exchanging wall (6), and
• wherein the cooling system further comprises a condenser arranged vertically above the vaporization chamber,
• wherein the cooling element comprises an inlet for cooling liquid at a first side of the vaporization chamber, and an outlet for a fluid stream comprising vapor at an opposite second side of said vaporization chamber, wherein a length direction of the vaporization chamber is from said inlet to said outlet,
• and wherein the condenser has an inlet with a first connection to the outlet for fluid stream and has an outlet with a second connection through a one way valve to the inlet of the vaporization chamber for cooling liquid, wherein the method comprises providing a cooling liquid to said vaporization chamber in contact with a second side of said heat exchanging wall wherein said second side is opposite of said first side, such that heat is exchanged from said integrated circuit to said cooling liquid thereby at least partially vaporizing said cooling liquid into vapor, wherein the vaporization chamber comprises channels and a plurality of flow-modifying structures that are arranged in series in the direction of the flow of the cooling liquid, such that the flow of the cooling liquid and the vapor is modified while the cooling liquid and the vapor flow through said channels in said vaporization chamber and in contact with said heat exchanging wall, wherein at least vapor flows up through said first connection to the condenser and is condensed to cooling liquid in the condenser by heat exchange against ambient air, and wherein only cooling liquid flows down from said one-way valve through said second connection by gravity flow, thereby driving transport of cooling liquid through the vaporization chamber.