Semiconductor structure
AssigneeNanya Technology Corporation
InventorsShing-Yih Shih, Mao-Ying Wang, Hung-Mo Wu
Life of this patent
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Abstract
A semiconductor structure includes a semiconductor device, a conductive line, a dielectric layer and a redistribution layer (RDL). The conductive line is present over the semiconductor device. The dielectric layer is present over the conductive line. The RDL includes a conductive structure over the dielectric layer and a conductive via extending downwards from the conductive structure and through the dielectric layer. The conductive via comprises a bottom portion, a top portion, and a tapered portion between the bottom and top portions, wherein the tapered portion has a width variation greater than that of the bottom and top portions.
Claims5
A semiconductor structure, comprising:
- a semiconductor device;
- a conductive line over the semiconductor device;
- a dielectric layer over the conductive line;
- and
- a redistribution layer (RDL) comprising a conductive structure over the dielectric layer and a conductive via extending downwards from the conductive structure and through the dielectric layer, wherein the conductive via comprises a bottom portion, a top portion, and a tapered portion between the bottom and top portions, wherein the tapered portion has a width variation greater than that of the bottom and top portions.
Dependencies are inferred from the claim text.