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US 2022/0028704 A1Published application
Molded packages in a molded device
AssigneeOctavo Systems LLC
InventorsMasood MURTUZA, Gene Alan FRANTZ
Life of this patent
Estimating the term…
Abstract
Packaged devices are provided for use inside an electronic system that provides access for molding compound or cables by using groove-like features on the bottom of a device package or on top of a substrate, and methods regarding the same. The groove-like features prevent voids in the encapsulant before and after packaging of the electronic system.
Claims23
A packaged device, comprising:
- (a) a packaged integrated circuit device, comprising:
- a substrate;
- and
- a packaged component attached to said substrate, wherein said packaged component comprises at least one vent on a bottom surface of said packaged component, or
- (b) a packaged SiP device, comprising:
- a substrate, wherein said substrate comprises a vent in a top surface of said substrate at a first location;
- and
- a packaged component, wherein said packaged component is attached to said substrate at said first location;
- or
- (c) said packaged device comprising a packaged SiP device, comprising:
- a substrate comprising an opening in said substrate that extends entirely through said substrate;
- and
- a packaged component attached to said substrate and located over said opening.
10 more elements
8-9. (canceled)
(canceled)
A method comprising:
- a) a method for packaging an integrated circuit device, comprising:
- providing a substrate;
- attaching a packaged component to said substrate, wherein the packaged component comprises a vent on a bottom surface of said packaged component, wherein the bottom surface of the packaged component faces a top surface of the substrate;
- placing said substrate and the attached packaged component in a packaging mold;
- and
- injecting an encapsulant into the packaging mold to create a package enclosing the substrate and the packaged component,
- wherein the encapsulant flows between the substrate and the packaged component,
- wherein any void formation while enclosing the substrate and the packaged component with the encapsulant is prevented by said vent, and
- wherein said vent is configured to allow gases trapped in the encapsulant to escape;
- or
- b) said method comprising a method for creating a substrate for a SiP device containing at least one packaged component using a scale model of the SiP device containing at least one packaged component and said substrate, wherein said at least one packaged component is attached to a surface of the substrate, comprising:
- simulating the flow of liquid encapsulant through said scale model of the SiP device;
- analyzing the simulation for any voids in the encapsulant between any one of the at least one packaged component and the substrate;
- modifying said SiP model to mitigate any voids, wherein modifying the design includes modifying said substrate which comprises any one of:
- modifying the substrate to include one or more vents or holes on a surface, and modifying any existing vents or holes on the substrate to mitigate any voids and modifying at least one of the at least one packaged components to include vents on its bottom mounting surface, modifying existing vents in said bottom mounting surface to mitigate any voids;
- simulating the flow of encapsulant for packaging the scale model of the SiP device using the modified design of the substrate;
- analyzing the simulation for any voids between the packaged component and the modified design of the substrate;
- repeating simulations with incremental substrate modifications until there are no voids between the packaged component and the modified design of the substrate;
- and
- creating the substrate with the modified design of the substrate that result in no voids;
- or
- c) said method comprising a method for designing a substrate for a SiP device containing at least one packaged component, comprising:
- creating a substrate design for said SiP device, wherein the substrate design comprises at least one vent over which each packaged component is to be mounted;
- manufacturing the substrate for the SiP device, wherein the substrate comprises the at least one vent for each packaged component:
- assembling SiP components and at least one packaged component on said substrate;
- and
- encapsulating the components into a SiP package;
- or
- d) said method comprising a method for creating a void free SiP device using a substrate containing at least one packaged device, comprising:
- assembling the SiP device, wherein assembling the SiP device comprises assembling SiP components on said substrate including said at least one packaged device;
- encapsulating said SiP to package said SiP;
- testing said packaged SiP device for voids;
- detecting the presence of voids in said packaged SiP;
- modifying the design of said substrate or components to include vents, or modify any existing vents to determine if further testing determines that existing or modified vents mitigate any voids;
- modifying the design of said SiP to properly space any included packaged devices or other devices or components to determine if testing determines that spacing mitigates any voids;
- encapsulating said SiP using said modified design of said substrate, components and SiP;
- analyzing said packaged SiP employing said modified design of said substrate and SiP simulation for any voids in said package;
- continuing the foregoing steps with additional incremental substrate, component, and SiP design modifications until there are no voids;
- and
- assembling said SiP using said modified substrate and SiP design.
37 more elements
16-17. (canceled)
(canceled)
Dependencies are inferred from the claim text.