US 2022/0028703 A1 · PRECISION RECONSTRUCTION FOR PANEL-LEVEL PACKAGING

Abstract

Panel level packaging (PLP) with high positional accuracy of dies. The PLP bonds dies accurately to die bonding regions of an alignment panel. High accuracy is achieved by providing die bonding regions with local alignment marks. Accurate die bonding on the alignment carrier results in a reconstructed wafer with accurate positioning of dies. The dies of the reconstructed wafer can be scanned by a die location check (DLC) scan based on sub-blocks of dies, enabling high DLC throughput. The DLC scan generates a DLC file with coordinate points of sub-blocks of the reconstructed wafer. Also, a laser direct imaging (LDI) file can be generated using sub-block circuit files aligned to the DLC file. The use of sub-block circuit files facilitates high throughput in generating the LDI file with high accuracy due to the reconstructed wafer being formed using the alignment carrier with local alignment marks.

Claims20

Dependent claims

A method for a die location check (DLC) comprising:

providing a reconstructed wafer having a block of dies encased in a mold compound, the block of dies includes a plurality of dies arranged in rows and columns to form a matrix of dies of the block, wherein the plurality of dies includes alignment dies and live dies;
scanning the reconstructed wafer, wherein the scanning comprises scanning the block of dies;
and
processing scan information of the block of dies, wherein the processing comprises
identifying positions of the alignment dies of the block of dies,
assigning one of the alignment dies of the block of dies as an origin point of a Cartesian coordinate system of the block of dies,
wherein scanning the block of dies includes scanning sub-blocks of dies one sub-block at a time, wherein each sub-block of dies includes the dies arranged in a sub-block matrix, the sub-block matrix includes a smaller number of dies than the matrix of the block of dies, and
assigning coordinate points for the sub-blocks of dies in the Cartesian coordinate system.

5 more elements

A method of bonding dies for panel level processing comprising

providing an alignment panel having a bonding surface which includes die bonding regions for bonding dies thereto, wherein the bonding surface includes local alignment marks, wherein the bonding surface includes a panel adhesive film for facilitating bonding the dies to the die bonding regions;
and
bonding a selected die to a selected die bonding region comprising
aligning the selected die to the selected die bonding region using the local alignment marks of the selected die bonding region, and
bonding the selected die to the selected die bonding region when the selected die is aligned to the selected die bonding region.

2 more elements

Dependencies are inferred from the claim text.

Precision reconstruction for panel-level packaging

Life of this patent

Precision reconstruction for panel-level packaging

Life of this patent

Abstract

Claims20